As artificial intelligence (AI) applications extend from the cloud to the edge, the surge in AI application-specific integrated circuits (ASICs) is accelerating growth in the semiconductor...
Taiwan's MPI Corporation, a major producer of probe cards and semiconductor test equipment, said artificial intelligence infrastructure demand is driving capacity utilization to maximum...
With Blackwell servers in full production, related server IC backend partners, including test interface providers, are expected to see a significant increase in revenue starting the...
The late 2024 surge in enthusiasm for artificial intelligence (AI) and high-performance computing (HPC) continues strong, driven by global cloud providers developing their own chips...
Taiwanese semiconductor testing solution providers such as MPI, WinWay, and Keystone Microtech achieved record-high revenues in 2024, driven by surging demand for AI and HPC.
In early October 2024, Nguyen Chi Dung, the Minister of Planning and Investment in Vietnam, announced that the government is prepared to collaborate with global artificial intelligence...
The ongoing surge in generative AI is propelling demand for advanced testing technologies, with leading testing interface providers Winway and MPI reporting impressive financial results...
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
Vietnam is drafting an Investment Support Fund to attract more foreign investment. However, Intel has expressed dissatisfaction with the administrative processes, calling for the...
ASE Technology Holding (ASEH) and other Taiwan-based IC backend houses are gearing up for a prosperous second half of 2024, stepping up their capacity expansion pace, according to...
IC test interface specialists MPI and WinWay Technology have observed an increase in orders requiring high-spec testing that involves more complex and longer processing at higher...
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
