Samsung Electronics has introduced the industry's first quad-core application processor built on the HKMG low-power process technology. With performance capabilities exceeding 1.4GHz based on the ARM Cortex A9 quad-core, the Exynos 4 Quad allows system-level architects to integrate maximized power efficiencies into smartphones and tablets which enables double the processing power at a 20% lower power bill over its predecessor, the 45nm process-based Exynos 4 Dual. Due to its 32nm HKMG low-power process and power-saving design, the Exynos 4 Quad has two-times the processing capability over the 45nm process based Exynos 4 Dual while consuming 20% less power. To improve power efficiency, Samsung adopted hot-plug functionality to support on-off switching for each core as well as the per-core dynamic voltage and frequency scaling (DVFS), which offers a dramatic reduction in power consumption by adapting different levels of voltage and frequency when changing workloads. Having identical form factor measurement (12X12X1.37mm), the Exynos 4 Quad is pin-to-pin compatible with the 32nm process based Exynos 4 Dual, allowing mobile device designers to immediately adopt the new solution without additional cost, engineering or design efforts. Already in production, the Exynos 4 Quad is scheduled to be adopted first into Samsung's next Galaxy smartphone that will officially be announced in May. Samsung's Exynos 4 Quad is also sampling to other major handset makers.

Intel has introduced the quad-core third-generation Intel Core processor family, delivering dramatic visual and performance computing gains for gamers, media enthusiasts and mainstream users alike. Available now in powerful, high-end desktop, notebooks and sleek all-in-one (AIO) designs, the new processors are the first chips in the world made using Intel's 22nm 3D tri-Gate transistor technology. The combination of Intel's 3D tri-gate transistor technology and architectural enhancements help make possible up to double the 3D graphics and HD media processing performance compared with Intel's previous generation of chips. As a result of the stunning, built-in visual performance, all the things people love to do on their PCs - from creating and editing videos and photos, surfing the Web, watching HD movies or playing mainstream games - are quicker, crisper and more life-like. With as much as 20% microprocessor performance improvements and new technologies to speed the flow of data to and from the chips, the new processors further extend Intel's overall performance leadership. In the coming months, additional versions of the third-generation Intel Core processors will be available to power a new wave of systems ranging from ultrabook devices, to servers and intelligent systems in retail, healthcare and other industries.

VIA Technologies has announced two latest additions to the VIA Modular Solutions portfolio, the VIA COMe-8X92 and the VIA QSM-8Q90. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles allowing customers to rapidly develop new and exciting devices. Measuring 95x95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module (COM) Express Compact form factor, developed and maintained by the PCI Industrial Computer Manufacturers Group (PICMG). The VIA COMe-8X92 module combines a 1.2GHz VIA Nano X2 E-series dual-core processor and the VIA VX900H media system processor (MSP) providing a ruggedized solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage. The VIA COMe-8X92 module also offers support for the latest connectivity standards including 18/24-bit single-channel LVDS, VGA, Display Port and HDMI with onboard I/O includes two SATA II ports, one GigaLAN port, one USB client port (shared with one of four USB 2.0 ports), four USB 2.0 ports, SDIO, expansion buses for one PCIe X4 and one PCIe x1 and the VIA Labs VL800 USB 3.0 host controller which offers support for four USB 3.0 ports. System memory support includes one slot for up to 4GB of SODIMM DDR3 RAM.