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Wednesday 18 March 2026
MOEA says 6G standard to be finalized by 2029, urges early preparation
Chao-Chung Kuo, director general of the Department of Industrial Technology at the Ministry of Economic Affairs (MOEA), announced that the 6G standard will be finalized by 2029 and...
Wednesday 18 March 2026
Samsung taps Apple, IBM, Walmart executives in global talent push
Samsung Electronics is actively recruiting top global talent, having lured several senior executives from multinational giants such as Apple, IBM, and Walmart through 2025. The move...
Wednesday 18 March 2026
Taiwan launches 6G industry forum
The Taiwan Association of Information and Communication Standards (TAICS) established the 6G Industry Forum (6GIF) on March 17, a platform for accelerating 6G technology and product...
Wednesday 18 March 2026
Apple adopts MediaTek Wi-Fi chip for MacBook Neo to save costs, say sources
Apple's recently launched affordable MacBook Neo has been found to use MediaTek's Wi-Fi and Bluetooth chips instead of Broadcom or Apple's own N1 chip, according to teardown reports...
Wednesday 18 March 2026
Oppo seeks to offset component cost pressures with global expansion and premium push
Oppo is preparing to cushion its smartphone business against rising component costs, particularly memory, after reaching annual shipments of around 100 million units. The company is...
Wednesday 18 March 2026
AI data center optics boom lifts Ezconn; orders seen through 3Q26, margin floor set at 50%
Surging global investment in AI data centers is accelerating growth for optical communications supplier Ezconn, which posted record revenue in 2025 after surpassing NT$10 billion for...
Monday 16 March 2026
Weekly news roundup: Memory crunch, AI supply chains, new manufacturing hubs
Below are the most-read DIGITIMES stories from the week of Mar 9-15, 2026:
Monday 16 March 2026
Taiwan's science park formula, now available for export to US
For decades, Taiwan's government-backed science parks have been the quiet engine behind the world's most powerful semiconductor supply chain. They incubated chip giants, clustered...
Monday 16 March 2026
India roundup: A reality check of chipmaking dream
Despite semiconductor manufacturing facilities expected in 2026, India remains a small player in the global chipmaking industry, as it is reportedly considering further incentives.
Saturday 14 March 2026
Samsung S26 sales in Taiwan rise 25%, 1TB model accounts for 15% of orders
Samsung Electronics' annual flagship Galaxy S26 series recently opened for pre-orders and began deliveries on March 13. Qi-meng Chen, general manager of Taiwan Samsung's mobile communications...
Saturday 14 March 2026
Taiwan braces for Section 301 probes after US Supreme Court ruling, leveraging prior pacts to cushion impact
The Office of the US Trade Representative (USTR) on March 11 launched investigations under Section 301 of the Trade Act of 1974 against 16 major trade partners, including China, the...
Friday 13 March 2026
Ai+ Smartphone to add 3 million device production capacity in India with Optiemus Electronics
Optiemus Electronics Limited (OEL), a wholly owned subsidiary of Optiemus Infracom Limited, has entered a manufacturing agreement with Ai+ Smartphone and NxtQuantum Shift Technologies...
Friday 13 March 2026
India weighs new smartphone export incentives and US$11 billion chip fund
According to Bloomberg and Reuters, India is considering two new incentive programs—one tied to smartphone exports and another worth more than US$11 billion...
Friday 13 March 2026
Apple prepares for its 50th anniversary with global celebrations as speculation grows over new products
Apple said it will celebrate its 50th anniversary in the coming weeks with events recognizing its history and global user community, while media reports suggest the milestone could...
Thursday 12 March 2026
Samsung reportedly wins foldable iPhone DRAM supply deal; 12GB LPDDR5X prices double
Samsung has reportedly secured an order to supply 12GB LPDDR5X DRAM for Apple's first foldable iPhone, negotiating a sharply higher price than in previous memory contracts.