Adata Technology has introduced a new DDR3 memory module series for cloud computing servers. Fully compatible with major motherboards, the server DIMM module helps reduce power costs and increase environmental protection, the vendor said. Is high efficiency, Adata indicated, enables major energy savings, leading to reduced overall power consumption for cloud businesses and lower carbon dioxide emissions.

Samsung Electronics has announced the development of 32GB DDR3 registered dual Inline memory modules (RDIMMs) that use 3D through silicon via (TSV) package technology. Its 30nm-class technology leverages module performance and power features to deliver what it calls a greener memory solution than the preceding 40nm-class based modules. Engineering samples have been released for evaluation. The new 32GB RDIMM with 3D TSV package technology is based on Samsung's 30nm-class 4Gb DDR3. It can transmit at speeds of up to 1,333Mbps, a 70% gain over preceding quad-rank 32GB RDIMMs with operational speeds of 800Mbps. The 32GB-module consumes a mere 4.5 watts per hour - the lowest power consumption level among memory modules adopted for use in enterprise servers, Samasung said. Compared to the 30nm-class 32GB load-reduced, dual-inline memory module (LRDIMM), which offers advantages in constructing 32GB or higher memory solutions, the new 32GB module provides approximately 30% additional energy savings.