Supply of leadframes for wirebonding packaging has been tight and will remain so through the end of 2022, which may be compounded if China's ongoing power curbs extend into fourth-quarter...
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Taiwan-based leadframe makers Shuen Der Industry (SDI) and Jih Lin Technology are optimistic about shipments for automotive power components and modules over the next two to three...
Taiwan's leading leadframe maker Chang Wah Technology (CWTC) is set to enjoy five golden years duing which supply will continue to fall short of demand, according to company chairman...
Tesla posting record production and sales of over 200,000 EVs in second-quarter 2021 has provided a significant growth engine for the EV and automotive electronics supply chains,...
Taiwan-based lead frame makers including SDI and Jih Lin Technology have obtained new orders for intelligent power modules from China, according to industry sources.
Chipmakers including MediaTek, Qualcomm and Realtek Semiconductor are striving to secure stable supply of leadframes for use in aQFN packaging, with related leadframe suppliers already...
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Leadframe supplier Chang Wah Technology (CWTC) has seen clear order visibility through April 2022, in line with wire-bonding process capacity at backend houses already booked by chipmakers...
I-Chun Precision Industry will soon hike quotes for leadframes used in LED and IC packaging to reflect increases in costs for copper and other metals, with the adjustment to vary...
The supply of foundry and packaging materials, such as photoresist and leadframes, has already fallen short of demand, prompting related distributors to raise prices, according to...
Taiwan-based leadframe makers including Shuen Der Industry (SDI) and Jih Lin Technology are poised to post sequential revenue increases through the third quarter of 2021, thanks to...
Taiwan leadframe makers are likely to raise quotes for leadframes for packaging automotive chips and power modules by 5-10% to reflect increased material costs amid increasing demand...
Major automotive chip vendors including NXP are mulling adopting FOPLP (fan-out panel level packaging) technology to process part of their peripheral automotive chips seeking to reduce...
