Chang Wah Technology (CWTC) has inaugurated a new facility in Kaohsiung, southern Taiwan, where it will manufacture leadframes for advanced quad flat no-lead (aQFN) packaging, third-generation...
Despite a slight correction in orders for automotive and industrial control applications, customers including IDMs are likely to restart their scramble for more supply of leadframes...
Taiwan-based leadframe suppliers including Chang Wah Technology (CWTC), Jih Lin Technology and Shuen Der Industry (SDI) are seen as beneficiaries as more IDMs offer automotive silicon...
LED backlight unit (BLU) specialist Darwin Precisions has stepped up its deployment in the QFN leadframe sector, optimizing its photo etching and electrochemical capability, according...
Despite chipmakers' near-term caution about market prospects, semiconductor materials demand remains promising in the longer term, according to market sources.
Leadframe demand for packaging automotive and industrial chips has slightly dropped, and that for consumer electronics ICs continues to be adversely affected by the ongoing inventory...
IC packaging leadframe and other materials demand is expected to hit bottom in the first quarter of 2023 and start recovering, according to industry sources.
IC packaging leadframe demand is expected to fall further in the fourth quarter of 2022 and shows no signs of recovery, as inventory adjustments for commodity chips are taking longer...
ASE Technology Holding continues to step up its leadframe and other IC packaging materials procurement while other outsourced semiconductor assembly and test (OSAT) vendors are slowing...
Chang Wah Technology (CWTC) has newly developed leadframes for miniLED device applications, which have cut into the supply chain of tier-1 Europe-based LED manufacturers, with shipments...
Market demand for silicon wafers, IC packaging leadframes, and other related process materials remains strong, and chipmaking materials distributors including Topco Scientific, Wah...
Chang Wah Technology (CWTC) has seen the visibility of QFP (quad flat package) leadframe orders extended, buoyed by strong demand for automotive, industrial and network communication...
Leadframe suppliers including Chang Wah Technology (CWTC), Jih Lin Technology and Shuen Der Industry (SDI) continue to see their supply for automotive IC packaging fall short of demand,...
High heat dissipation and other thermal management technologies are increasingly required for both front- and back-end chipmaking processes by companies engaged in the automotive,...
