News tagged Hanmi at DIGITIMES

NEWS TAGGED HANMI

Wednesday 19 August 2026

Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned...

Thursday 13 August 2026

Hanmi pulls ahead of Hanwha as HBM4 orders rebound

South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...

Monday 20 July 2026

Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms

South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...

Thursday 16 July 2026

Hanmi, Hanwha clash in court over HBM equipment patents

Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically...

Wednesday 8 July 2026

ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand

South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...

Saturday 27 June 2026

Hanmi targets advanced packaging market with FC Bonder 3.5

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

Friday 12 June 2026

Hanmi Semiconductor to invest in SpaceX as Terafab bets grow

Hanmi Semiconductor plans to invest KRW50 billion (US$32.81 million) in SpaceX, highlighting how space, satellites, and artificial intelligence infrastructure are increasingly linked...

Tuesday 9 June 2026

SK Hynix orders Hanmi equipment for HBM4 capacity buildout

SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand...

Friday 5 June 2026

Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows

Hanmi Semiconductor is projecting record annual revenue this year, as rising demand for high-bandwidth memory equipment lifts prospects for the South Korean chip-equipment maker and...

Monday 9 March 2026

India roundup: Japan, South Korea deepen push as semiconductor and tech investments expand

Japanese and South Korean firms are expanding their presence in India as the country strengthens its semiconductor and technology ecosystem. Rohm has partnered with Suchi Semicon for...

Thursday 5 March 2026

Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt

Competition in the high bandwidth memory (HBM) market is intensifying, prompting equipment makers such as Hanwha Semitech and Semes to accelerate...

Thursday 5 March 2026

Hanmi Semiconductor strengthens ties with India amid Micron facility launch

South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry's first dual-function BOC COB Bonder, capable of performing both Board-on-Chip...

Thursday 15 January 2026

Hanmi Semiconductor leans into EMI shielding as satellite and 6G demand grows

Hanmi Semiconductor has drawn industry attention in recent years for its thermal compression bonding equipment used in high-bandwidth memory production. As low-earth-orbit satellite...

Monday 15 December 2025

SK Hynix taps ASMPT for HBM4 TC bonders amid Hanmi-Hanwha patent clash

SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations...

Friday 7 November 2025

Hanmi to launch Wide TC Bonder for HBM5 high stacking in 2026

Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM)...

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