DIGITIMES observes that as AI accelerators continue to grow in size, substrate dimensions are gradually moving beyond 100x100mm. Warpage issues in organic substrates have...
The rise of local large language models (LLMs) and AI agents is reshaping operating system competition, according to DIGITIMES Intelligence. While Windows dominates through its software...
DIGITIMES observes that as large language models (LLMs) and agentic AI development become increasingly widespread, it is driving not only significant growth in data center CPU demand...
At Hon Hai Tech Day 2026 (HHTD 26), Foxconn showcased the Nvidia DSX POD containerized solution. By leveraging factory pre-building, electromechanical integration, and pre-testing,...
ASML and TSMC announced plans in September 2026, ahead of the SPIE BACUS symposium, to advance high-numerical-aperture extreme ultraviolet (High NA EUV) lithography by replacing the...
As edge AI applications and AI agents move toward real-world deployment, industrial control and embedded processors are undergoing a structural upgrade in computing capabilities.
Arm is expanding its business model from licensing Neoverse core IP and compute subsystem (CSS) technologies to selling finished server CPUs for artificial general intelligence (AGI)...
Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking...
Following TSMC's third-quarter 2026 earnings call, DIGITIMES analyst Luke Lin provided in a podcast additional analysis of several details that received limited attention in market...
Invasive brain-computer interfaces (BCIs) are demonstrating long-term commercial potential. Neuralink has enabled paralysed patients to control computers and robotic arms through thought;...
DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through...
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
The world's three largest memory manufacturers—Samsung Electronics, SK Hynix, and Micron Technology—along with Taiwan-based Nanya Technology, Winbond Electronics, and Macronix...
Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
