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    Resonac develops 12-inch SiC substrate to target AI and EV demand
    5h 5min ago
    High-end GPUs may be slowing China’s AI compute expansion
    5h 5min ago
    2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
    5h 5min ago
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    5h 5min ago
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    5h 5min ago
    NEWS TAGGED DIGITIMES INSIGHT
    Thursday 17 September 2026
    DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027
    DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion...
    Wednesday 16 September 2026
    DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

    DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

    Wednesday 16 September 2026
    DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy
    DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have...
    Wednesday 16 September 2026
    DIGITIMES Insight: Taiwan's small IC design firms face a weaker second half after rebound

    Taiwan's smaller IC design firms posted a strong revenue recovery in the first half of 2026, but the gains may prove difficult to extend...

    Wednesday 16 September 2026
    DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck

    At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well...

    Wednesday 16 September 2026
    DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

    SK Hynix is reportedly considering Intel as an additional manufacturing source for high-bandwidth memory (HBM) base dies beginning with...

    Tuesday 15 September 2026
    DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting
    DIGITIMES Intelligence forecasts the global semiconductor market will expand from US$791.7 billion in 2025 to US$1.6 trillion in 2026, representing year-on-year growth of 109.1%.
    Tuesday 15 September 2026
    Robot supply strategies split between US in-house tech and Chinese local ecosystem
    As humanoid robots gradually move from laboratory proofs-of-concept and enter industrial manufacturing and commercial service, their underlying motion control and environmental perception...
    Monday 14 September 2026
    DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
    ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...
    Monday 14 September 2026
    DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
    Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
    Monday 14 September 2026
    DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
    Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity...
    Tuesday 1 September 2026
    Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
    DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...
    Friday 28 August 2026
    Insight: China's next AI frontier is silicon, not smarter models
    For the past two years, China's AI companies have competed on a single axis: whose model performs best. That contest is starting to give way to a harder one — whether those models...
    Monday 24 August 2026
    Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
    ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
    Friday 21 August 2026
    Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
    The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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