DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through...
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
The world's three largest memory manufacturers—Samsung Electronics, SK Hynix, and Micron Technology—along with Taiwan-based Nanya Technology, Winbond Electronics, and Macronix...
Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
SpaceX announced on October 8, 2026, that it would acquire US 800MHz low-band spectrum licenses held by Grain Management, covering up to 14MHz of paired bandwidth. The transaction...
Chinese automakers are accelerating their expansion into humanoid robotics, leveraging artificial intelligence (AI) technologies, electric drive systems, and supply chain resources...
Meta's recent introduction of its personal AI agent, Muse, has renewed interest in AI assistants capable of operating across devices. Unlike conventional...
AI is changing the logic of telecom traffic growth, with Ericsson and industry researchers warning that mobile networks must now handle not only more data, but also more uplink traffic,...
The boundary for adopting external capacity is changing, as workloads that previously needed memory offload because of insufficient high-bandwidth memory (HBM) can now run directly...
Demand for agentic AI in commercial and consumer markets was rising rapidly, and the market appeal of consumer services such as Meta Muse was expanding. In agentic AI tasks, large...
As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of...
South Korea's leading telecommunications operator, SK Telecom (SKT), recently established SK Hyper and SK Horizon in quick succession. The moves mark a pivotal shift for telecommunications...
