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    CXMT targets DDR5 RDIMM mass production by end-2026
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    Nvidia expands China gaming partnerships
    10h 10min ago
    US promotes AI exports as chip industry flags supplier gaps and reshoring costs
    10h 10min ago
    Commentary: The methodology behind Lip-Bu Tan’s strategy of vulnerability for Intel
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    Analysis: GF finds high-value outlet for mature capacity through advanced packaging, lessons for China
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    NEWS TAGGED DIGITIMES INSIGHT
    Monday 12 October 2026
    DIGITIMES Insight: Personal AI agents could reshape who controls the smart cockpit experience

    Meta's recent introduction of its personal AI agent, Muse, has renewed interest in AI assistants capable of operating across devices. Unlike conventional...

    Monday 12 October 2026
    DIGITIMES Insight: Why AI is shifting telecom traffic to the uplink
    AI is changing the logic of telecom traffic growth, with Ericsson and industry researchers warning that mobile networks must now handle not only more data, but also more uplink traffic,...
    Wednesday 7 October 2026
    DIGITIMES Insight: HBM expansion raises the bar for memory offload
    The boundary for adopting external capacity is changing, as workloads that previously needed memory offload because of insufficient high-bandwidth memory (HBM) can now run directly...
    Wednesday 7 October 2026
    DIGITIMES Insight: AI servers will carry nearly twice as many CPUs per accelerator by 2027
    Demand for agentic AI in commercial and consumer markets was rising rapidly, and the market appeal of consumer services such as Meta Muse was expanding. In agentic AI tasks, large...
    Monday 5 October 2026
    DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks
    As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
    Friday 2 October 2026
    DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
    Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
    Thursday 1 October 2026
    DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
    TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
    Thursday 1 October 2026
    DIGITIMES Insight: Agentic AI shifts inference bottleneck to token control and task quality
    DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of...
    Wednesday 30 September 2026
    DIGITIMES Insight: AI is emerging as the new growth anchor in the mobile communications industry
    South Korea's leading telecommunications operator, SK Telecom (SKT), recently established SK Hyper and SK Horizon in quick succession. The moves mark a pivotal shift for telecommunications...
    Saturday 26 September 2026
    DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders

    China's two leading memory suppliers are moving to raise capital and expand output as demand for chips grows, a shift that could reshape...

    Tuesday 22 September 2026
    DIGITIMES Insight: Full-color Micro LED set to exceed 30% of AR glasses shipments in 2027

    The industry has converged on a single precondition for consumer adoption of augmented reality (AR) glasses: the product must look like...

    Monday 21 September 2026
    DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
    DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
    Thursday 17 September 2026
    DIGITIMES Insight: SiC substrate capacity expansion continued; 6-inch substrate prices expected to rebound in 2027
    DIGITIMES has observed that demand for silicon carbide (SiC) power devices has climbed rapidly in recent years as the EV market expands, triggering a massive wave of capacity expansion...
    Wednesday 16 September 2026
    DIGITIMES Insight: Google outlines AI compute expansion, speeds TPU cycle to 6 months

    DIGITIMES Intelligence said Google used SEMICON Taiwan 2026 to outline the direction of its AI infrastructure strategy, focusing not...

    Wednesday 16 September 2026
    DIGITIMES Insight: Taiwan can power its AI chip boom — but not with green energy
    DIGITIMES Intelligence observes that discussions at the semiconductor sustainability and energy forum during SEMICON Taiwan 2026 centered on two questions: whether Taiwan will have...
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    BIZ FOCUS
    Oct 15, 08:00
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI
    Wednesday 14 October 2026
    Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
    Wednesday 14 October 2026
    Practical Insights & Industry Ideas
    Wednesday 14 October 2026
    GMIF 2026 Awards: Samsung, SanDisk, BIWIN, and Others Honored