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Alibaba unveils biggest Qwen model as DeepSeek deepens China's AI price war
ICT
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Semiconductors
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Aug 3, 18:57
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TGV still faces technical barriers; CoPoS commercialization not likely until 2030
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Friday 3 July 2026
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DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...
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Tuesday 2 June 2026
Display to semiconductor: Panel makers weaponize large glass substrates for FOPLP
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Monday 25 May 2026
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Wednesday 13 May 2026
Global smartphone AP industry, 1Q 2026: Memory price hikes pressure smartphone AP market
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Monday 20 April 2026
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Thursday 16 April 2026
Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond
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Monday 30 March 2026
Taiwan wafer foundry industry, 1Q 2026 and 2026 forecast
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Friday 20 March 2026
Global top-3 memory maker status, 1Q 2026
Introduction
Monday 16 March 2026
Global smartphone AP industry, 4Q 2025
Introduction
Thursday 12 March 2026
Taiwan IC designers in rack-level AI delivery
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Wednesday 4 March 2026
Global OSAT industry, 2026
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Thursday 12 February 2026
Global semiconductor industry, 2026
Introduction
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BIZ FOCUS
Jul 30, 08:00
EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
Monday 1 June 2026
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
Thursday 30 July 2026
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
Wednesday 29 July 2026
Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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TSMC's AI bottleneck spills demand across the semiconductor supply chain
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Micron, MediaTek back ChipAgents as agentic AI startup extends series A to US$134 million
YMTC rejects patent-loss claims in global 3D NAND clash with Micron
Montage brings CXL 3.2 memory expansion to AI data centres with Samsung, SK Hynix support
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