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NEWS TAGGED CHAUN-CHOUNG TECHNOLOGY
Tuesday 28 April 2020
Taiwan makers gearing up for 0.3mm-thick vapor chamber shipments
Taiwan-based smartphone cooling module specialists are capable of producing vapor chambers with thickness of only 0.3mm and will begin shipping the cooling solutions for smartphones...
Wednesday 4 March 2020
Cooling specialists expanding capacity for 5G handset applications
Taiwan-based thermal solutions providers are keenly proceeding with capacity expansions for heat pipes and vapor chambers seeking to meet robust demand for 5G handset applications...
Friday 29 November 2019
Cooling module makers eyeing robust application demand for 5G devices
The commercialization of 5G communication networks will spur the growth of both base station and smartphone markets, which in turn will significantly drive demand for high-performance...
Tuesday 29 October 2019
Samsung, Huawei embracing VC cooling solutions for smartphones
Use of vapor chamber cooling modules for smartphones is set to expand significantly in 2020 as Samsung Electronics and Huawei are likely to have all of their 5G phones slated for...
Monday 16 September 2019
Heat-sink solution providers to brace for strong sales along with 5G deployments
The development of 5G networks including infrastructures, edging computers and end-market devices will significantly scale up global demand for heat-sink solutions in 2020 and beyond,...
Monday 2 September 2019
Taiwan component makers seek opportunities from 5G and foldable devices
Taiwan-based component makers, despite seeing shrinking demand for notebooks, have found new opportunities from emerging businesses such as foldable smartphones, foldable-screen notebooks...
Thursday 29 August 2019
Cooling solutions providers to expand capacities on 5G smartphone demand
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics are all moving to expand their capacities for vapor chambers (VCs) to cash in...
Monday 15 July 2019
Taiwan cooling solution providers poised for robust growth
Taiwan's cooling module suppliers are set for robust growth in 2020 and beyond driven by demand for heatpipe- or vapor chamber (VC)-based heat dissipation solutions from the smartphone...
Thursday 11 July 2019
Vapor chamber to account for 50% of smartphone cooling module shipments in 2H19
With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...
Thursday 27 June 2019
Rising public cloud demand triggering business model changes
With the public cloud continuing expanding its presence in the cloud computing market, a few players including HPE and Chaun-Choung Technology (CCI) have been pushing new products...
Tuesday 25 June 2019
Chaun-Choung poised to enter EV heatsink segment
Taiwan-based cooling module maker Chaun-Choung Technology (CCI) is poised to tap into the segment of heatsink solutions for electric vehicles and self-driving cars through Japan's...
Tuesday 26 February 2019
Cooling specialist Auras reportedly enters Samsung, Huawei supply chains
Taiwan-based Auras Technology has Korea and China smartphone vendors among its clients for cooling modules and will move to expand production of heat spreaders seen to be increasingly...
Tuesday 2 October 2018
Nidec to invest in cooling module firm CCI
Cooling module maker Chaun-Choung Technology (CCI) has disclosed that Japan-based Nidec is planning to acquire up to a 48% stake in the company through a tender offer at NT$108 (US$3.50)...
Wednesday 19 September 2018
Cooling module firms see server demand accelerate
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics have seen demand from the server sector accelerate since the beginning of second-half...
Friday 14 September 2018
Smartphone vendors looking for new thermal management solutions for 5G phones
While preparing to launch 5G-enabled smartphones in the first half of 2019, most major handset vendors are reportedly seeking new thermal management solutions in response to heat...
Jun 27, 10:16
CoreTech System joins hands with Microsoft Azure and creates new values for application of molding analysis
Thursday 23 June 2022
DEKRA collaborates with VicOne to create integrated services for vehicle cybersecurity certification
Wednesday 15 June 2022
Panel level packaging boosts massive growth by perceived cost advantage and productivity benefits
Tuesday 14 June 2022
Fully supporting Taiwan networking solution providers, Fibocom applies the sales success formula in 5G era
Taiwan foundries to see fab utilization rates stay above 90% in 2H22
Notebook sales to pick up in 3Q22
GlobalWafers on track to expand silicon wafer capacity
TSMC sees major clients queue up for 3nm process capacity
GF, SMIC may bear the brunt of consumer chips demand downturn
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
AIO PC shipment decline to in 2Q22, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – May 2022
Notebook shipments rebound in May with China COVID lockdowns easing, says DIGITIMES Research
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