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    Taiwan Mobile says D2C satellite services not urgent priority as AI drives data-center and power concerns
    2min ago
    Wistron invests in quantum computing and small satellites to power AI-era growth
    4min ago
    Skymizer launches HTX301 decode-first accelerator to bring large-model inference on-premises
    6min ago
    WPG says AI era will reward supply-chain ecosystems over individual firms
    6min ago
    Ion Electronic Materials ramps Miaoli plant to mass production of high-end specialty gases
    8min ago
    NEWS TAGGED BOOK-TO-BILL RATIO
    Thursday 28 May 2026
    Yageo tops Murata in AI-driven passive component orders

    Yageo, one of the world's largest passive component suppliers, said demand from AI-related applications has pushed its book-to-bill ratio...

    Friday 15 May 2026
    AAEON sees rising orders as AI focus drives 2026 growth plan
    AAEON Technology reported sustained demand growth and a rising book-to-bill ratio, signaling stronger momentum into the second quarter and second half of 2026. The industrial PC maker...
    Wednesday 10 December 2025
    Yageo posts record November revenue on strong AI demand, Shibaura acquisition gains

    Yageo reported year-over-year and month-over-month revenue growth for November 2025, driven by the acquisition benefits from Japan-based...

    Monday 21 August 2023
    IPC makers eyeing China's infrastructure smartification as next growth driver
    China's economic recovery has fallen short of expectations, and many industry players are not optimistic about sales there in the second half of 2023. Nevertheless, Taiwan's industrial...
    Tuesday 18 July 2023
    BB ratio for MLCCs rises
    The book-to-bill ratio for multi-layer ceramic capacitors (MLCC) has risen to 0.91 on average from 0.84 in April, as orders from ODM customers have resumed, according to sources at...
    Friday 11 November 2022
    Nan Ya PCB sees increasing rush orders for BT substrates
    Taiwan's IC substrate supplier Nan Ya PCB has witnessed a surge in rush orders for BT substrates needed to process memory and other chip solutions for mobile smart devices and TV applications,...
    Monday 18 July 2022
    Ennoconn eyeing 10% of Taiwan public cloud market by 2025
    Taiwan-based IPC vendor Ennoconn, an affiliate of Foxconn Technology, is set to develop cloud-ground integration services as a new business line and will launch ESG+ Edge AI cloud...
    Monday 29 November 2021
    IPC makers see record order visibility, may suffer from component shortage
    Taiwan's industrial PC (IPC) makers, including Advantech, Ennoconn, DFI, Axiomtek and Adlink Technology, all see record order visibility thanks to strong order placements from clients...
    Wednesday 25 January 2017
    US fab tool book-to-bill ratio rises to 7-month high
    The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 1.06 in December 2016, the highest in seven months, compared with 0.96 in the prior month and 1.00...
    Friday 16 December 2016
    NA semiconductor equipment industry posts November book-to-bill ratio of 0.96, says SEMI
    North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2016, compared with 0.91 in the prior month and 0.96 a year ago, according...
    Wednesday 23 November 2016
    US fab tool book-to-bill ratio slips below parity
    The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.91 in October 2016 after having stayed above parity for 10 straight months.
    Tuesday 22 November 2016
    Japan chip gear orders rise 7% in October, says SEAJ
    Japan-based semiconductor equipment manufacturers posted JPY139.3 billion (US$1.3 billion) in orders in October 2016 (three-month average basis), up 7.3% from JPY129.85 billion in...
    Monday 24 October 2016
    North American semiconductor equipment industry posts September book-to-bill ratio of 1.05
    North America-based semiconductor equipment manufacturers posted US$1.60 billion in orders worldwide in September 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...
    Monday 19 September 2016
    US fab-tool book-to-bill ratio stays above parity, says SEMI
    North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.03 in August 2016, having been above parity for nine months in a row, according to the...
    Wednesday 24 August 2016
    US fab-tool book-to-bill ratio rises, says SEMI
    North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.15 in July 2016, having been above parity for eight months in a row, according to the...
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    Research Report Database
    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook