Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Wednesday 15 September 2021
Memory module houses gearing up shipments for new DDR5 products
Memory module houses are gearing up for the upcoming rollouts of new-generation PC products supporting DDR5 memory, while slowing down their purchases of DDR4 chips, according to...
Friday 12 April 2019
Digi-Key launches BOM MTBF prediction service empowered by BQR reliability digital solutions
Digi-Key Electronics, a global electronic components distributor, and BQR Reliability Engineering Ltd, a worldwide leader of reliability and maintenance engineering solutions, present...
Friday 16 November 2018
Auras adopts new ERP system for digital transformation
Taiwan-based thermal solutions provider Auras Technology has sharply overhauled its ERP (enterprise resources planning) system to step up its digital transformation, integrating IT...
Wednesday 16 May 2018
EMS firms see profits eroded by ever-rising passive component costs
Taiwan EMS firms, especially smaller ones, are seeing their profitability increasingly eroded as their downstream customers are reluctant to absorb increases in production cost driven...
Friday 23 March 2018
Galaxy S9+ materials cost US$43 more than previous versions, says IHS Markit
The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions...
Thursday 9 November 2017
iPhone X costs Apple US$370 in materials, says IHS Markit
Teardown engineers at IHS Markit have completed their preliminary physical dissection of the new Apple iPhone X and found that the model A1865 version of the smartphone with 64GB...
Tuesday 26 September 2017
Apple iPhone 8 Plus carries over US$280 BOM, IHS teardown reveals
The new Apple iPhone 8 Plus, equipped with 64GB of NAND flash memory, carries a bill of materials (BOM) cost that comes out to US$288.08, higher than any previous versions of the...
Thursday 1 June 2017
MediaTek launches next-gen Wi-Fi chipset portfolio for IoT
MediaTek has announced its next-generation Wi-Fi chipset portfolio for connected smart home, office and other IoT applications. The MediaTek MT7686, MT7682, and MT5932 will deliver...
Monday 24 April 2017
Galaxy S8 materials costs highest by far compared to previous versions, IHS teardown reveals
The new Samsung Galaxy S8 equipped with 64 gigabytes (GB) of NAND flash memory carries a bill of materials (BOM) cost that comes out to US$301.60, much higher than for previous versions...
Tuesday 21 October 2014
Intel may stop providing subsidies for mobile solutions; switch to providing support through different methods
With better-than-expected performance in the third quarter of 2014, some market watchers have speculated that Intel will stop providing subsidies for its mobile device solutions to...
Wednesday 16 April 2014
Samsung Galaxy S5 carries over US$250 BOM, IHS teardown reveals
The Samsung Galaxy S5 with 32GB of NAND flash memory carries a BOM of US$251.52, according to IHS. The cost rises to US$256.52 when the US$5 manufacturing cost is added.
Thursday 26 September 2013
Apple iPhone 5s carries US$199 BOM and manufacturing cost, IHS says
Apple's new flagship product- the iPhone 5s- features some cutting-edge components that represent pioneering achievements for the smartphone market while maintaining a nearly identical...
Thursday 29 August 2013
Decrease in manufacturing costs helps Xiaomi new Red Rice smartphone carry a US$85 BOM, says TrendForce
According to global market research firm TrendForce, smartphone manufacturing costs are decreasing, which is changing the shipment proportion of handsets. In 2014, entry-level devices...
Tuesday 6 November 2012
Low-end iPad Mini carries US$188 BOM, says IHS
The base model of Apple's new iPad Mini with Wi-Fi only and 16G of NAND flash memory carries a bill of materials (BOM) of US$188, according to research firm IHS. When the US$10.00...
Veeam Software
Summary of Tech Supply Chain News!
China's homegrown NearLink wireless tech to challenge Wi-Fi dominance, says DIGITIMES Research
China's smartphone shipments threaten 20% slide in 1Q24 says DIGITIMES Research
AP shipments to Chinese smartphone brands unpleasant in 4Q23, but to stay flat in 1Q24, says DIGITIMES Research