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    Nanoimprint tools see a shift from round to square substrates
    3h 14min ago
    Taiwanese chipmakers step up visual sensing and motor drive for future robot market
    3h 14min ago
    Shenzhen Huacheng XinGuang sees microLED optical interconnect is viable for data centers
    3h 15min ago
    Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
    3h 15min ago
    Analysis: Is China's ASML gambit worth the cost as rivals pull ahead on EUV?
    3h 15min ago
    NEWS TAGGED BOM
    Tuesday 21 July 2026
    Electronics Supply Chain Outlook: Where H2 2026 Momentum Is Heading

    Six months into 2026, the story isn't whether the electronics supply chain has stabilized. It has, broadly. The real story is that it has split into two distinct markets...

    Friday 10 July 2026
    Apple iPhone 18 Pro Max BOM could jump US$300 as memory costs soar

    New figures from Counterpoint Research estimate that the bill of materials (BOM) for the upcoming iPhone 18 Pro Max could rise nearly...

    Thursday 15 January 2026
    Smartphone panel prices hit by memory price surge
    Rising memory prices have pushed up smartphone bill of materials (BOM) costs, potentially affecting shipments for 2026. As the smartphone panel market enters its seasonal off-peak...
    Friday 19 December 2025
    Memory shortages reshape smartphone market as costs hit 35% of mid-range devices
    Research institutions predict that global smartphone shipments could decline by 1–2% in 2026 due to memory shortages, with mid- and low-range devices expected to be most affected...
    Thursday 17 October 2024
    New regulations for Taiwanese vehicles take effect; manufacturers and supply chains overwhelmed
    The Ministry of Economic Affairs' Industrial Development Administration (IDA) published guidelines for recognizing localized supply chain cooperation value ratios for Chinese vehicle...
    Tuesday 8 March 2022
    GF announces next-gen silicon photonics solutions
    GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
    Wednesday 15 September 2021
    Memory module houses gearing up shipments for new DDR5 products
    Memory module houses are gearing up for the upcoming rollouts of new-generation PC products supporting DDR5 memory, while slowing down their purchases of DDR4 chips, according to industry...
    Friday 12 April 2019
    Digi-Key launches BOM MTBF prediction service empowered by BQR reliability digital solutions
    Digi-Key Electronics, a global electronic components distributor, and BQR Reliability Engineering Ltd, a worldwide leader of reliability and maintenance engineering solutions, present...
    Friday 16 November 2018
    Auras adopts new ERP system for digital transformation
    Taiwan-based thermal solutions provider Auras Technology has sharply overhauled its ERP (enterprise resources planning) system to step up its digital transformation, integrating IT...
    Wednesday 16 May 2018
    EMS firms see profits eroded by ever-rising passive component costs
    Taiwan EMS firms, especially smaller ones, are seeing their profitability increasingly eroded as their downstream customers are reluctant to absorb increases in production cost driven...
    Friday 23 March 2018
    Galaxy S9+ materials cost US$43 more than previous versions, says IHS Markit
    The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions...
    Thursday 9 November 2017
    iPhone X costs Apple US$370 in materials, says IHS Markit
    Teardown engineers at IHS Markit have completed their preliminary physical dissection of the new Apple iPhone X and found that the model A1865 version of the smartphone with 64GB of...
    Tuesday 26 September 2017
    Apple iPhone 8 Plus carries over US$280 BOM, IHS teardown reveals
    The new Apple iPhone 8 Plus, equipped with 64GB of NAND flash memory, carries a bill of materials (BOM) cost that comes out to US$288.08, higher than any previous versions of the company's...
    Thursday 1 June 2017
    MediaTek launches next-gen Wi-Fi chipset portfolio for IoT
    MediaTek has announced its next-generation Wi-Fi chipset portfolio for connected smart home, office and other IoT applications. The MediaTek MT7686, MT7682, and MT5932 will deliver...
    Monday 24 April 2017
    Galaxy S8 materials costs highest by far compared to previous versions, IHS teardown reveals
    The new Samsung Galaxy S8 equipped with 64 gigabytes (GB) of NAND flash memory carries a bill of materials (BOM) cost that comes out to US$301.60, much higher than for previous versions...
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    GlobalExhibition
    BIZ FOCUS
    Sep 9, 08:00
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
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