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NEWS TAGGED ARDENTEC
Thursday 1 September 2022
OSATs strive to grow revenues from automotive sector
Taiwan-based OSATs including ASE Technology, Powertech Technology Group (PTI), King Yuan Electronics (KYEC), Ardentec, Sigurd Microelectronics are all looking to grow revenues from...
Friday 19 August 2022
Backend demand for automotive MCUs, MPUs stays robust
Backend demand for automotive MCUs and MPUs remains in high gear, with OSATs and packaging materials suppliers seeing clear order visibility through the end of this year, according...
Friday 1 July 2022
Ardentec breaks ground for new factory site in Taiwan
Dedicated IC testing house Ardentec has broken ground for a new factory site in Longtan, northern Taiwan, and expects to start operating the site by 2024.
Monday 16 May 2022
Taiwan OSATs embracing more car, industrial IC orders from IDMs
International IDMs including Infineon and STMicroelectronics continue stepping up production of automotive, industrial control and networking chips to meet ever-rising demand, outsourcing...
Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...
Tuesday 15 March 2022
Wi-Fi 6/6E on track to go mainstream in 2022
Wi-Fi 6/6E will officially go mainstream in 2022 and is set to penetrate across all application segments, which will benefit all the related IC supply chain players including core...
Monday 25 October 2021
OSATs to see strong backend orders for car-use MCUs in 2022-2023
International IDMs are set to raise quotes for automotive MCUs in 2022, and their backend partners in Taiwan are all expected to sustain robust backend momentum through 2022-2023...
Thursday 30 September 2021
Taiwan OSATs grab huge orders from Renesas
OSATs including Ardentec, ASE Technology, King Yuan Electronics (KYEC) and Powertech Technology (PTI) have landed significant backend orders for automotive MCUs from Japan's Renesas...
Tuesday 7 September 2021
ASE steps up recruiting engineers for 5G, networking, automotive chips
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Monday 30 August 2021
OSATs to sustain tight testing capacity well into 2022
Taiwan's OSATs are expected to sustain tight capacity supply for chip probing and final test operations through 2022, as the visibility of their orders, particularly from international...
Wednesday 4 August 2021
Testing houses to see strong 1Q22
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec are all expected to post a particularly strong first quarter of 2022, as...
Friday 23 July 2021
Automotive IC IDMs in talks with OSATs about demand in 2022
First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...
Thursday 15 July 2021
Wafer probing houses see order visibility for car chips strenghtened
Taiwan-based wafer probing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all seen order visibility extended well into 2022, driven by international...
Tuesday 6 July 2021
KYEC to regain growth in 3Q21 after 31% revenue fall in June
Taiwan's dedicated IC testing house King Yuan Electronics (KYEC) will see its business operations return to a growth track in the third quarter of the year after its June revenues...
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