Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity

At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Seoul, January 6, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase its next generation AI memory solution at CES 2026, in Las Vegas from January 6 to 9 (local time).The company said that, "Under the theme 'Innovative AI, Sustainable tomorrow' we plans to showcase a wide range of next generation memory solutions optimized for AI and will work closely with customers to create new value in the AI era."SK hynix has previously operated both a SK Group joint exhibition and a customer exhibition booth at CES. This year, the company will focus on the customer exhibition booth to expand touchpoint with key customers to discuss potential collaboration.The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with 36GB, which demonstrated industry's fastest speed of 11.7Gbps, and is under development aligned with customers' schedules.12-layer HBM3E product with 36GB which will drive the market this year will also be presented. In particular, the company will jointly exhibit GPU modules that have adopted HBM3E for AI servers with customer and demonstrate its role within AI systems.In addition to HBM, the company plans to showcase SOCAMM2, a low-power memory module specialized for AI servers, to demonstrate the competitiveness of its diverse product portfolio in response to the rapidly growing demand for AI servers.Also, SK hynix will exhibit its lineup of conventional memory products optimized for AI, demonstrating its technological leadership across the market. The company will present its LPDDR6, optimized for on-device AI, offering significantly improved data processing speed and power efficiency compared to previous generations.In NAND flash, the company will present its 321-layer 2Tb QLC product, optimized for ultra-high capacity eSSDs, as demand surges from rapid expansion of AI data centers. With best-in-industry integration, this product significantly improves power efficiency and performance compared to previous generation QLC products, making it particularly advantageous in AI data center environments where lower power consumption is needed.The company will set up an 'AI System Demo Zone' where visitors can experience how its AI system memory solution that is being prepared for the future, interconnect to form AI ecosystem.In this zone, the company will present customized cHBM optimized for specific AI chip or system, PIM based AiMX, CuD which conducts computing in memory, CMM-Ax that integrated computing capabilities into CXL memory, and Data-aware CSD.For cHBM(Custom HBM), due to specific interest from customers, a large-scale mock-up has been prepared to allow visitors to visually sight its innovative structure. As the competition of the AI market shifts from mere performance to inference efficiency and cost optimization, this visualizes a new design approach that integrates part of computation and control functions into HBM which was handled by conventional GPU or ASIC in the past."As innovation triggered by AI accelerates further, customers' technical requirements are evolving rapidly," Justin Kim, President & Head of AI Infra at SK hynix, said. "We will meet customer needs with differentiated memory solutions. With close cooperation with customers, the company will create new value to contribute to the advancement of the AI ecosystem."SK hynix's next-generation AI memory products on display at CES 2026. Credit: SK hynix

At CES 2026, DEEPX will present a new paradigm for AI infrastructure - one designed for the physical world. As AI expands beyond data centers into robots, mobility, smart cities, factories, and intelligent devices, DEEPX positions itself at the core of this transformation with energy-efficient, real-time AI semiconductors purpose-built for Physical AI.Much like Arm reshaped the CPU industry through low-power innovation, DEEPX aims to establish a new global standard for Physical AI by delivering ultra-efficient AI accelerators. DEEPX enables intelligence to operate reliably and sustainably in real-world environments, addressing the critical constraints of power, heat, and cost.DEEPX's technology leadership has already been validated in the global market. In addition to winning two CES Innovation Awards in the Computing Hardware and Embedded Technologies categories, DEEPX-powered solutions have achieved the industry's highest recognition. Notably U.S.-based partner Sixfab received the CES Best of Innovation Award for its ALPON X5 AI Gateway, powered by DEEPX's first-generation AI chip, DX-M1. This success serves as a testament to DEEPX's solutions being more than just a component supply; they are recognized as a core engine and a game changer that elevates global partners' products to a world-class level.DEEPX will host a dedicated booth at the Las Vegas Convention Center (LVCC), North Hall – AI & Robotics Zone (#8945). The exhibit will showcase real-world deployments of AI semiconductors across robotics, drones, factory automation, retail, and intelligent infrastructure, proving that Physical AI has moved beyond concept and into commercial-scale deployment.At the booth, DEEPX will showcase performance targets for its next-generation DX-M2 AI chip, built on an advanced 2nm process. The DX-M2 is designed as a foundational infrastructure chip for the Physical AI era, solving the fundamental power and scalability limitations of data-center-centric architectures.Furthermore, DEEPX will launch its Open-Source Physical AI Alliance, formed in collaboration with leading AI software ecosystems including Baidu PaddlePaddle and Ultralytics' YOLO community. This initiative reflects DEEPX's strategy to tightly integrate hardware and software, accelerating global adoption of Physical AI through open, developer-friendly platforms."CES 2026 marks a pivotal moment for DEEPX - not just showcasing technology achievements, but demonstrating how Physical AI becomes real infrastructure through global partnerships,"said Lokwon Kim, CEO of DEEPX.

Mobilint, a South Korean fabless AI chipmaker, announced that it will showcase its efficient and production-ready industrial edge AI processors and their real-time demonstrations at CES 2026, to be held from January 6 through 9 at the Las Vegas Convention Center.MLX-A1, the company’s standalone edge AI box, was recently named a CES 2026 Innovation Award Honoree in the Artificial Intelligence category. The compact 1.3 kg system was recognized for its ability to run advanced AI workloads locally - including language, vision, and multimodal models - within a 70-watt, laptop-class power envelope, without relying on cloud services, servers, or GPUs. By addressing latency, power consumption, cost, and data privacy challenges, MLX-A1 enables practical AI deployment across industrial environments.Designed for flexible integration, MLX-A1 supports both retrofitting existing equipment and deploying new production lines without added infrastructure complexity, while delivering meaningful power and cost savings.MLX-A1 is powered by ARIES, Mobilint's high-efficiency AI accelerator chip, capable of delivering up to 80 TOPS of performance. ARIES entered mass production in 2024 and is now shipping globally in multiple form factors, supporting scalable deployment across industrial and commercial systems.Mobilint will also present REGULUS, its ultra-compact AI system-on-chip that won the CES 2025 Innovation Award, during the exhibition. Measuring 17 mm × 17 mm, REGULUS delivers up to 10 TOPS of AI performance at under 3 watts, enabling always-on, on-device AI in space- and power-constrained environments such as smart sensors, embedded vision systems, and low-power industrial devices.Throughout CES 2026, Mobilint will run live, application-focused demonstrations showcasing real-time video analytics, local AI assistants, and multi-model AI processing executed directly on its hardware. These demonstrations emphasize low-latency inference, stable real-time operation, and energy efficiency.In addition, Mobilint will feature joint demonstrations with global industrial platform partners including Lanner and Autonics, highlighting how its AI processors can be integrated into existing systems with minimal modification, enabling AI upgrades without full system replacement."CES 2026 gives us the opportunity to demonstrate our edge AI technologies that are ready for immediate deployment in real industrial settings," said Dongjoo Shin, CEO and CTO of Mobilint. "By combining high-performance, power-efficient AI processing technology with close collaboration with global partners, we will further accelerate AI adoption across industries and continue to strengthen our technological competitiveness in the global market."Visitors can experience Mobilint's CES Innovation Award–winning MLX-A1, REGULUS, and its latest edge AI hardware at Booth No. 9129 in the North Hall, LVCC, during CES 2026.