As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

The intellectual property dispute between Corning and China-based IRICO has entered a new phase at the U.S. International Trade Commission (ITC), with the focus shifting from the finding of trade secret misappropriation to potential remedies affecting access to the U.S. market.On July 23, an ITC Administrative Law Judge (ALJ) issued an Initial Determination finding that IRICO and the remaining respondents had misappropriated Corning trade secrets related to its fusion glass manufacturing technology. The judge followed with a recommended remedy on August 6, and on August 7 the ITC issued a public interest notice disclosing part of that recommendation, including a proposed Limited Exclusion Order (LEO) against IRICO and the remaining respondents.The August 7 notice provided the first meaningful public indication of the remedies being considered. When the Initial Determination was announced in July, only limited information was available publicly. For Corning, the notice marks an important step toward potential enforcement measures following the ALJ's finding that its fusion-draw trade secrets had been misappropriated."Corning welcomes the initial determination and recommended exclusion order by the International Trade Commission. The determination makes clear that IRICO misappropriated Corning's proprietary fusion-draw technology, underscoring the value of Corning's innovations," said Brendan Mosher, International Vice President and General Manager, Corning Display Technologies."Protecting our intellectual property reflects our Values and our commitment to doing what's right for the last 175-years. Through these actions, we are safeguarding our innovations, our people, and our ability to do what we do best: transform industries, support our customers, and improve lives."Ruling Extends to Manufacturing and Downstream ProductsThe July 23 Initial Determination found that IRICO had misappropriated key Corning trade secrets related to fusion glass manufacturing, with the technology at issue broadly used across IRICO's glassmaking operations. The ruling did not narrow its scope based on glass generation size, glass composition, or other product-specific conditions, and applied to the remaining respondents in the case, including TCL, CSOT, and CHOT.That distinction is important because the central issue of misappropriation is not simply which glass formulation is being used, but how the glass is manufactured. If the final determination follows the current direction, changing a glass composition or product specification alone would be unlikely to provide IRICO with a workaround.Exclusion Order Raises the Stakes for Display ManufacturingThe August 7 public interest notice confirmed that the ALJ recommended a Limited Exclusion Order restricting U.S. imports of display products containing IRICO glass. For Corning, the significance of the remedy lies in how a dispute over manufacturing technology can carry through the broader display production chain.Display glass sits near the beginning of that chain. Once produced, the substrate moves through panel fabrication, module integration, and system assembly before ending up in televisions and other finished products. Because the case centers on the fusion manufacturing technology used to make the glass rather than on a single composition, Corning believes the ruling creates significant risk for customers that continue to source IRICO glass for products intended for the U.S. market.Corning is also seeking review of the recommended multi-year exclusion period, arguing that the evidence presented in the case supports a longer duration and that the final Commission determination could ultimately impose a longer restriction.Corning Seeks Review of Limited IssuesCorning has petitioned the full Commission to review several narrowly defined issues. Corning's petition does not challenge the central finding that IRICO misappropriated Corning's fusion technology, nor does it challenge the issuance of an exclusion order. Instead, they focus on clarifying the transparent process Corning has taken to protect intellectual property rights and support the growth of the display industry in China and across the globe."While we appreciate the ALJ's confirmation that IRICO misappropriated Corning's technology, as well as the recommended exclusion order, Corning is seeking review of certain statements in the determination ," said Mosher."We have consistently acted with transparency, integrity, and responsible stewardship of its innovations, while supporting the growth of the display industry, and will continue to take all appropriate steps to protect Corning's intellectual property."Corning maintains that it clearly and consistently communicated its concerns related to IRICO's misappropriation of its trade secrets, preserved its right to seek remedy, and presented substantial evidence in this regard.In addition, Corning maintains its course of action over the years with respect to IRICO and the display industry was reasonable and considerate, and that it had continuously taken measures over the years to protect its trade secrets.Commission Review Comes NextThe case has not yet reached a final ITC determination. Following the ALJ's Initial Determination, the full Commission reviews the decision and ultimately issues the Commission's Final Determination. Corning's current petitions are part of that process and identify the limited issues it wants the Commission to reconsider.Corning is also reiterating that intellectual property protection remains a fundamental part of its long-term research and innovation strategy. The company emphasizes that invention and innovation have been at the core of its business for 175 years and that its intellectual property reflects sustained investments in R&D, technology development, and industry collaboration. When it identifies unauthorized use or misappropriation of its technology, Corning says it will take the necessary steps to protect those investments.As the fusion trade secret case moves through Commission review, Corning will continue taking appropriate steps to protect its intellectual property while supporting the continued growth and development of the display industry.

With more than 35 years of experience in ASIC design services, Progate Group Corporation (PGC, TPEx: 8227), a member of the TSMC Design Center Alliance (DCA) and a Synopsys IP OEM Program partner, provides cost-effective and flexible ASIC turnkey services to help startups and enterprises overcome the barriers to customized chip development and accelerate their products from concept to mass production.PGC's integrated development path covers IP licensing, IP integration, IC design, physical implementation, tape-out, manufacturing, packaging, testing, and mass production - combining its ASIC design expertise with the TSMC ecosystem and Synopsys IP resources. PGC's website states that the company has taped out more than 1,500 projects at TSMC and supports both CyberShuttle/MPW and mass-production services.As artificial intelligence (AI) and high-performance computing (HPC) applications continue to expand, demand for customized ASICs is increasing across a wide range of applications, including AI acceleration, Edge AI, networking, and other computing applications. However, high non-recurring engineering (NRE) costs, complex IP integration, and lengthy development cycles remain major challenges for companies seeking to develop their own chips.Lowering the Barriers to ASIC DevelopmentASIC development has traditionally been dominated by large enterprises with significant semiconductor resources and engineering capabilities. With the rapid growth of AI applications, however, more startups and enterprises are looking to develop customized chips to achieve better performance, lower power consumption, and improved cost efficiency.PGC addresses these challenges through its one-stop ASIC turnkey service, giving customers access to the expertise and resources required throughout the chip development lifecycle without having to build a complete ASIC development organization internally.Through the Synopsys IP OEM Program, PGC also provides access to cost-competitive IP solutions and supports the integration of high-speed interface and other semiconductor IP, helping customers reduce IP licensing costs, simplify development, and shorten the overall design cycle. PGC's current service portfolio includes high-speed interface IP integration such as PCIe, USB, MIPI, SerDes, DDR, and die-to-die interfaces.Case Study 1: AI Startup Accelerates FPGA-to-ASIC Migration with MPW/Shuttle FlowAn AI startup specializing in image recognition initially used FPGA technology for product development. As market demand grew, the company faced increasing cost and power-consumption challenges, making the FPGA-based solution less suitable for large-scale production.After engaging PGC, the company transitioned from FPGA to ASIC through PGC's FPGA-to-ASIC solution. To reduce the initial development cost and lower the risk of ASIC adoption, the customer adopted an MPW/Shuttle flow for the first silicon implementation. PGC also integrated multiple high-speed interface IPs and managed the ASIC design flow from development through tape-out.The project achieved First Silicon Success on the first tape-out, along with a significant reduction in power consumption, an approximately 10 percentage reduction in overall cost, and an approximately 20 percentage reduction in time-to-market compared with the company's original FPGA-based development timeline.The project demonstrates how PGC's FPGA-to-ASIC solution and MPW/Shuttle flow can help AI startups reduce initial development costs and technical risks while providing a practical path from FPGA prototyping to ASIC implementation and subsequent mass production.PGC's existing service model supports the transition from smaller-volume MPW/CyberShuttle runs to full-mask development and high-volume production, allowing customers to select an appropriate development path as their products mature.Case Study 2: Edge AI Company Develops a Customized SoCAn Edge AI company sought to develop a customized SoC to meet growing demand for intelligent edge applications. Compared with conventional off-the-shelf solutions, a customized chip offered better integration, lower power consumption, improved performance, and greater flexibility for the company's target applications.Developing an ASIC requires expertise across system architecture, IP selection and integration, IC design, physical implementation, manufacturing, and testing. The company therefore sought an experienced ASIC partner to accelerate development while managing overall project cost and risk.PGC provided a comprehensive turnkey solution covering system architecture planning, IP integration, IC design, physical implementation, tape-out, manufacturing, packaging, and testing. By integrating the required IP and managing the development flow end to end, PGC helped the customer move efficiently from system requirements to a finished customized SoC.The result was improved system integration and performance, reduced overall system cost, and better power efficiency, giving the customer greater flexibility to optimize its chip for specific Edge AI applications.This case demonstrates PGC's ability to support not only AI startups but also companies developing next-generation Edge AI solutions, helping them build in-house customized chip capabilities and strengthen long-term product competitiveness.PGC has specifically highlighted FPGA-to-ASIC migration and Edge AI SoC development as important application areas, with its turnkey platform covering front-end design, back-end APR, tape-out, MPW/CyberShuttle runs, and subsequent production.Flexible ASIC Turnkey Services for Different Development NeedsPGC offers a flexible development model designed to support projects of different sizes and stages. Customers can choose from multiple development and manufacturing models, including MPW/Shuttle services, mass production (MP), and Customer-Owned Tooling (COT), allowing them to select an approach that matches their budget, production requirements, and long-term business strategy.For startups and companies entering ASIC development for the first time, an MPW/Shuttle flow can provide a practical and cost-effective approach for initial silicon development and validation. By sharing wafer costs across multiple projects, MPW can help reduce the upfront cost of producing prototype silicon compared with a dedicated full-mask approach.As products mature and production volumes increase, PGC can support customers in transitioning from prototype silicon to mass production. Its turnkey service covers the broader supply chain, including wafer fabrication, CP/FT testing, packaging, and production support.Through its one-stop turnkey model, PGC can coordinate IP, design, foundry, packaging, and testing resources, helping customers reduce project complexity and focus on their core product and application development.Combining TSMC, Synopsys and OSAT Ecosystem ResourcesPGC's turnkey model is built around close collaboration with major semiconductor ecosystem partners. As a certified member of the TSMC Design Center Alliance, PGC provides TSMC ASIC design and CyberShuttle services. The company also works with Synopsys through the IP OEM Program and collaborates with ASE and other OSAT partners for packaging and testing.This ecosystem-based approach allows PGC to integrate design, IP, manufacturing, packaging, and testing resources into a coordinated development flow. For startups and small and medium-sized companies, this can reduce the need to independently manage multiple semiconductor suppliers and technical interfaces throughout the ASIC development process.PGC also supports advanced-node ASIC development. Its current service portfolio includes TSMC 6nm, 5nm, 4nm, and 3nm FinFET processes, as well as advanced packaging services such as CoWoS.Looking AheadPGC plans to deepen its collaboration with ecosystem partners while expanding IP integration and advanced-process design capabilities, including support for more advanced TSMC process nodes and continued growth of its Synopsys IP OEM offerings.The company will continue to focus on helping startups and enterprises move from FPGA or off-the-shelf solutions toward customized ASIC architectures, particularly for AI, Edge AI, HPC, networking, and other high-growth applications.By combining ASIC design expertise, TSMC ecosystem resources, Synopsys IP access, and flexible MPW/Shuttle, MP, and COT models, PGC aims to help more companies overcome the traditional barriers to ASIC development.The goal is to lower development risk and cost, accelerate time-to-market, and provide a practical path from initial silicon development to mass production - enabling more startups and enterprises to build customized AI and Edge AI chips and strengthen their long-term product competitiveness.For more information, please visit the official website.

As demand for AI servers, high performance computing (HPC), and data center infrastructure accelerates, the semiconductor and power electronics test equipment market is experiencing strong growth. This momentum is expected to continue as advanced semiconductor technologies drive increasingly sophisticated testing requirements.Chroma ATE Inc., a company with more than two decades of experience in automated test equipment (ATE), recently held its Semiconductor Test Equipment User Conference in Hsinchu, Taiwan. Registration quickly reached capacity, reflecting the company's growing prominence in the semiconductor testing market. In 2025, Chroma reported consolidated revenue of US$943 million and grew its global workforce to nearly 4,000 employees.Credit: ChromaAddressing the Testing Challenges of the AI Era with In-House InnovationGeorge Chang, President of Chroma's Semiconductor Test Equipment Business Unit (STE BU), emphasized that Chroma is one of the few ATE suppliers with the in-house capability to develop  application-specific integrated circuits (ASICs) for its own test systems. This capability creates a "technology moat" that reinforces Chroma's competitive advantage.To address the diverse needs of the semiconductor testing market, Chroma has built its portfolio around three specialized test platforms. The Chroma 3680 is designed for advanced devices used in AI, HPC, microcontroller unit (MCU), and mixed-signal applications, the Chroma 3650 addresses power devices and systems-on-chip (SoCs), and the Chroma 3380 targets mainstream MCUs, Internet of Things (IoT) devices, and other chips manufactured on mature process nodes. Combined shipments across the three platforms have exceeded 4,000 systems. This year, Chroma also introduced the compact Chroma 3650-S2C platform for high-power devices, responding to increasingly rapid product cycles across the semiconductor industry.Proprietary PINF ASIC Enables Seamless Migration for Complex SoC TestingAs AI and HPC drive more complicated chip designs, testing is becoming more diverse and technically more demanding. At the same time, the industry is facing growing pressure to reduce costs and shorter test development schedules. Spancer Lee, Senior Manager of product marketing at Chroma's STE BU, explained that the Chroma 3680 integrates Chroma's next-generation, self-developed PINF ASIC with a range of specialized system boards, each supporting different test functions. This architecture enables comprehensive coverage across four major testing domains: digital, analog, mixed-signal, and RF devices. Chroma plans to continue expanding the platform's capabilities, leveraging the flexibility of its in-house hardware development to support high-precision testing of increasingly complex and high-frequency SoC devices. To accommodate the intensive data transfer and processing requirements involved with testing advanced semiconductor devices, the Chroma 3680 employs an 8-lane, 20 Gbps parallel high-speed data architecture. Optimized firmware enables high-speed transfer and more efficient processing of complex test data. The architecture also minimizes synchronization latency between digital and analog resources, improving resource integration for highly complex SoC test programs.The Chroma 3680 architecture is also compatible with certain probe card models used on competitor platforms. This allows customers to retain existing load boards and test programs without modifying their hardware, reducing migration costs while maximizing ROI and helping chipmakers gain a competitive edge in the market.Credit: ChromaChroma 3650-S2C Delivers High-Voltage Capability in a Compact FootprintWith NVIDIA signaling a transition toward direct 800V DC power delivery for server racks, semiconductor manufacturers face growing demand for high-voltage testing. To address this need, Chroma developed the 3650-S2C, a new test platform optimized for high-power semiconductor devices including silicon carbide (SiC) and gallium nitride (GaN). Through extensive engineering refinement, the platform's slot count was reduced to six, optimized for the requirements of intermediate-level testing. Chroma also substantially streamlined the external high-voltage power rack by integrating it directly into the test head. The 3650-S2C cuts the system footprint by half, enabling seamless integration with mainstream turret handlers for volume production while helping OSAT partners save valuable factory space and infrastructure costs.Aaron Chuang, Senior Manager of Advanced Technology Development at Chroma's STE BU, highlighted two key characteristics of the Chroma 3650-S2C: powerful high-voltage capability and a compact footprint. Building on the proven Chroma 3650-S2 platform, the solution integrates a high-voltage source-measurement unit (HVSMU) board to deliver a comprehensive, one-stop solution for five critical test parameters. It enables customers to safely and accurately overcome the 4 kV test threshold while maintaining production throughput, providing a powerful foundation for next-generation high-voltage power semiconductors to advance into mass production.Credit: ChromaIntegrated High-Density RF Technology Addresses Next-Generation Ultra-High-Frequency Wireless TestingThe rapid adoption of AI, edge computing, and intelligent connected devices continues to drive growth across Wi-Fi, Bluetooth, GNSS, IoT, mobile, and wearable applications. At the same time, wireless communication chipsets are undergoing a significant generational upgrade.To address these evolving requirements, Chroma has integrated its new HDRF3 (high-density radio frequency) test module into the Chroma 3680 platform. The solution is designed to support the increasing bandwidth, advanced modulation schemes, and multi-antenna architectures required by next-generation wireless technologies. This positions the company to capture the high-performance networking and AIoT chip packaging and testing markets.According to Jackson Hsu, associate director of application engineering at ADIVIC, a Chroma-affiliated company, Wi-Fi 7 expands channel bandwidth from 160 MHz to 320 MHz while increasing modulation density to 4096-QAM. These advances place exacting demands on RF performance and noise characteristics in test instrumentation. The HDRF3 test module was specifically developed to meet these requirements, extending operating frequencies up to 8 GHz and providing full coverage for Wi-Fi 7 as well as future Wi-Fi 8 implementations.ADIVIC also plans to launch an extension model, the 35809, featuring a simplified 16-port design while maintaining complete software compatibility with the production-oriented HDRF3 platform. The solution is targeted at applications requiring RF IC testing only. Chroma's in-house ASIC expertise allows the company to adapt the hardware architecture of its Chroma 3680, 3650, and 3380 platforms to distinct market requirements. From the space-efficient Chroma 3650-S2C to the high-density HDRF3 module, each development addresses emerging technical challenges across the semiconductor industry.Credit: ChromaThrough a combination of flexibility, high return on investment, and seamless platform migration strategies, Chroma helps customers accelerate adoption while reducing operational barriers. As AI, advanced computing, wireless connectivity, and power semiconductors continue to reshape the industry, Chroma is positioning itself as a long-term strategic partner for the world's leading semiconductor manufacturers.