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REALTIME NEWS
Jensen Huang urges Germany to embrace physical AI at Berlin summit
ICT
1min ago
Samsung eyes six foldables for 2027, including a rollable phone
Communications
14min ago
Japan's MMX mission launches successfully, gains edge over China in race for first Mars system sample return
Aerospace
18min ago
Global Tek's new Thailand plant enters trial production in 3Q26, targeting AI liquid cooling and aerospace opportunities
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Thursday 1 October 2026
From Excel to Editable Presentations: AI Streamlines Financial Reporting
Financial institutions routinely process massive volumes of operational data, turning complex analysis into executive presentations for trend tracking, performance evaluations, and strategic decision-making. While routine, this process is notoriously time-consuming — especially under tight deadlines when managers request a deck on short notice...
Thursday 1 October 2026
Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
Speed 3D Inc., a Taiwan-based AI software company specializing in computer vision, generative AI and hardware integration, will showcase Picbot Edge at Snapdragon Summit 2026 in Maui, Hawaii, September 22–24. The event marks Picbot Edge's first international showcase outside Taiwan, following its world debut at Computex 2026.
Wednesday 30 September 2026
AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
On September 23, the 5th GMIF2026 Innovation Summit successfully concluded at the Renaissance Shenzhen Bay Hotel...
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking
China tightens drone export controls, extending restrictions to critical components, technologies
SK Hynix moves AI data centers from processor-centric to memory-centric design
OCP 2026 shifts AI competition from chips to rack-scale systems
Intel says it is the only high-volume fab for 12-inch InP silicon photonics as co-packaged optics nears deployment
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