Cincoze has unveiled its all-new CV-200 Series slim-bezel industrial displays. The CV-200 Series features a minimalist profile, a narrow bezel, and industrial-grade reliability for industrial panel PCs and industrial touch monitors. Specifically engineered for modern factory HMI and process visualization, they carefully balance the durability required for harsh environments with seamless equipment integration and intuitive operation. The modular design of the CV-200 Series offers screen sizes from 10 to 21.5 inches for over 40 possible configurations. The first release is the 21.5" Full HD models with almost ten configuration options for various application needs.Ultra-Slim Bezel, High Visibility, and an Intuitive User ExperienceThe CV-200 Series offers clear visuals and smooth operation, and integrates easily into production line equipment. Its slim, die-cast aluminum alloy frame has a bezel less than 3mm wide, increasing the display area without changing existing equipment setup. The Full HD screen and 178° wide viewing angle ensure clear and crisp readability from any position. Every model features a projective capacitive (P-Cap) touchscreen with an anti-glare (AG) coating for the clearest images, even in high-brightness indoor lighting conditions. Touch response is fast and precise, making daily HMI operation smoother and more natural.Rugged and Durable for Industrial and Humid EnvironmentsThe CV-200 Series is built to handle harsh, humid industrial environments. It has an IP66-rated front panel and Wet Tracking technology, so the touchscreen works reliably even with wet fingers or splashes of water. The backlight lasts up to 50,000 hours, and a 7H hardness Glass-Glass (GG) panel adds durability. The CV-200 Series meets the IEC 61000-6-4 industrial EMC standard, ensuring stable, long-term operation and giving operators total peace of mind.Flexible Modular DesignCincoze's exclusive Convertible Display System (CDS) technology lets you pair the CV-200 Series with embedded computer modules (P2000/P1000 Series) or monitor modules (M1000 Series). Customers can configure the system as either an industrial panel PC or an industrial touch monitor, depending on display size, computing performance, and functional requirements. This plug-and-play design simplifies deployment and maintenance. If repairs are needed, only a single module needs to be replaced, cutting downtime, lowering maintenance costs, and streamlining future upgrades.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect. Together, the collaboration enables hyperscale customers to transition more efficiently from silicon definition to deployment-ready AI infrastructure.AI clusters continue to scale in performance, bandwidth and power density, hyperscalers must increasingly evaluate silicon, packaging, interconnect, thermal and rack-level design choices much earlier in the development cycle. Through this collaboration, GUC and Wiwynn are aligning key technology pillars, including leading-edge ASIC implementation, 2.5D/3D advanced packaging, optical I/O, power delivery, thermal architecture, manufacturability, serviceability and rack-scale integration. By addressing these factors holistically at the outset, the collaboration partners aim to reduce integration complexity, improve development efficiency and accelerate the transition from silicon-ready innovation to system-ready AI infrastructure."As AI infrastructure evolves beyond chip-level optimization and scale-up networks push the limits of conventional electrical interconnects, close alignment across silicon to system architecture become critical," said Aditya Raina, Chief of Marketing of GUC. "By collaborating with Wiwynn, we are helping hyperscale customers evaluate critical system-level tradeoffs earlier, integrating optical I/O to deliver the bandwidth and power efficiency required for next generation AI systems. This partnership establishes a more practical, holistic path from flagship ASIC development to deployable, rack-scale AI infrastructure."With deep expertise across board-level innovation, rack-scale integration, and manufacturing, Wiwynn effectively bridges semiconductor innovation with data center deployment," said Tony Wen, Vice President at Wiwynn. "Together with GUC, we are enabling a comprehensive silicon-tosystem approach that delivers scalable, efficient and serviceable AI infrastructure tailored for nextgeneration hyperscale environments."For more information, please visit.

Chroma ATE Inc. successfully concluded the 3rd Chroma Paper Award on March 19, marking another milestone in the company's ongoing commitment to industry-academia collaboration. Organized in partnership with National Taiwan University of Science and Technology (Taiwan Tech), the Chroma Paper Award provides an exchange platform that accelerates the translation of research into real-world applications, fostering innovation and the cultivation of key talent.As high-performance computing (HPC) and AI applications continue to advance rapidly, demand for test and measurement technologies is rising across AI chips, HPC, and data centers. In this era of lightning-fast iteration, testing and validation have become critical enablers of system performance and reliability. With long-standing expertise in this field, Chroma has built comprehensive AI-related testing capabilities spanning the four core pillars of AI infrastructure: compute and data processing, cooling and thermal management, high-speed communications and data transmission, and power and energy management. Through its test and validation solutions, Chroma helps ensure the performance, stability, and reliability of AI systems, playing a vital enabling role across the AI value chain.Aligned with Chroma's core technology development priorities, this year's competition featured two main categories: Power Electronics-Related Technologies and Semiconductor Testing-Related Technologies. Each category included a Top Prize (NT$200,000), Excellence Prize (NT$100,000), and Merit Prize (NT$20,000), with total prize funding reaching nearly NT$1.5 million. A total of 101 papers were submitted. Following a multi-stage evaluation process comprising preliminary, secondary, and final reviews, the judging committee selected outstanding research projects distinguished by both technical innovation and strong potential for industrial application.In the Power Electronics-Related Technologies category, the Top Prize was awarded to a team from Taiwan Tech for the project "Development of a High Power Density Power Module for AI Server Applications." Supervised by Associate Professor Yu-Chen Liu and completed by student Yu-Jun Li, the project directly addresses the growing need for high-efficiency, high-power-density power systems in AI data centers.In the Semiconductor Testing-Related Technologies category, the Top Prize went to a team from National Taiwan University for the project "A Novel Full-Chip Afterpulsing Evaluation Technique for 116 x 160 Ge-on-Si SPAD Array." Supervised by Professor Chao-Hsin Wu and jointly completed by students Jia-Zhen Cai, Ren-Hong Zhang, and Qi'en Chen, the research presents innovative achievements in advanced sensing and semiconductor testing technologies.Following the award ceremony, Chroma invited finalist teams into its R&D labs and testing facilities to see firsthand how research outcomes are transformed into real systems and industrial applications. The visit further strengthened ties between academia and industry.As the AI era continues to evolve at speed, test and measurement serves not only as a gatekeeper of quality but also as a key engine of innovation. Looking ahead, Chroma will continue to deepen its engagement with the global academic community through the Chroma Paper Award and a range of industry-academia collaboration initiatives, building an open and impactful platform that advances key technologies and sustains innovation momentum across the industry.For the full list of award winners, please visit the official Chroma Paper Award website.President Jia-Yush Yen of National Taiwan University of Science and Technology delivers remarks. Credit: ChromaCredit: ChromaFinalist students pose for a group photo with Chroma Foundation Chairman Paul Ying. Credit: ChromaChroma ATE Chairman Leo Huang (left) poses with the Top Prize-winning student Yu-Jun Li. Credit: ChromaChroma ATE Chairman Leo Huang (left) poses with the Top Prize-winning student Jia-Zhen Cai. Credit: ChromaFinalist teams visit Chroma headquarters. Credit: ChromaGroup photo at the 3rd Chroma Paper Award ceremony and banquet. Credit: ChromaChroma ATE Chairman Leo Huang delivers remarks. Credit: ChromaChroma Foundation Chairman Paul Ying delivers remarks. Credit: Chroma