As cloud computing and data center industries accelerate the adoption of open architecture and open firmware, the traditional firmware ecosystem is undergoing deep restructuring.AMI and Taiwan's ODMs Join Forces to Build the Next-Generation InfrastructureOpen architecture has shifted from a technical option to an industry mainstream. Kenneth Tao, Director of Business Development at American Megatrends International (AMI), emphasizes that the company constantly adjusts its strategy and product roadmap to align with industry evolution, positioning itself as an "open architecture builder" that provides truly adoptable open-source platforms.From IP Code to Open Source: AMI Responds Precisely to Industry TransformationAs CSPs increasingly collaborate directly with ODMs, the industry's structure has changed significantly. Tao explains that Cloud Service Providers (CSPs) are no longer merely purchasing off-the-shelf products - they now seek greater control over product definition and resources, gradually establishing maintainable proprietary platforms. Many CSPs come from open-source ecosystems and prefer building platforms using their own open firmware frameworks to gain greater control and differentiation.AMI has long-standing ties with the Open Compute Project (OCP), having collaborated since the early days of OCP's promotion of open hardware specifications. Recognizing the widespread adoption of OCP-compliant servers and the push for standardized hardware production by ODMs, AMI proactively established corresponding firmware standards and validation processes. It also participates in multiple working groups to convert standards into product development guidelines, accelerating customer adoption. Notably, AMI became the first independent BIOS vendor to receive OCP S.A.F.E. designation, helping ODMs/OEMs provide firmware security and code quality assurance to end users.Based on this foundation, AMI introduced open platforms such as MegaRAC Community Edition and Aptio Community Edition, helping customers swiftly implement open-source strategies. In this evolving ecosystem, AMI plays the role of "infrastructure provider at the firmware layer," creating a stable and scalable base. This allows clients to integrate their own IPs and pursue differentiated development. Tao emphasizes that this is not simply a technical decision - it reflects a systematic transformation responding to the needs of the value chain. AMI has evolved from a traditional IP vendor into a builder of open architecture committed to delivering a maintainable, multi-scenario firmware platform.Transforming from Proprietary Firmware to Open Architecture: A Major ChallengeTao acknowledges that this transition is a major undertaking. The biggest hurdle is the varying definitions and expectations of "open source" across industry players. CSPs want different ODM platforms to share the same firmware base to ensure consistency in testing, maintenance, and deployment. ODMs, meanwhile, must meet both CSPs' open-source demands and diverse customization requirements from enterprise clients, facing dual pressures.On the technical side, challenges abound - OpenBMC differs significantly from AMI's traditional IP BMC architecture. AMI's previous development environment centered around Debian. OpenBMC, however, is based on the Yocto framework, which complicates integration.To solve these issues, AMI developed the "OneTree Architecture," which manages multiple system codebases in a unified way, establishing a standardized and scalable open firmware foundation. This allows customers to rapidly develop and extend proprietary features while minimizing integration and maintenance costs. AMI also adopts a strategy of "Open Source Base + Commercial Value-Added Modules." The open base offers a standard framework for rapid deployment, while proprietary IP modules are selectable based on needs, enhancing differentiation and market competitiveness.Accelerating ODM Transformation with AMI's Open Platforms: Reducing Maintenance Costs and Boosting CompetitivenessMany ODMs have already implemented AMI's open solutions. Tao points out two major benefits for ODMs. First, AMI's pre-built open architectures allow for seamless integration with hardware platforms, shortening development and validation cycles. Second, they reduce maintenance burdens, as both OpenBMC and BIOS are complex systems requiring continuous updates and significant manpower for security management. With AMI's support and standardized open platform, ODMs can minimize their maintenance costs.Looking Ahead: Full Strategic Deployment Across Four PillarsFor future planning, Tao shares that AMI will strategically invest in four key areas: "Talent Development", "Toolchain", "System-Level Management Support", and "Validation Platforms." To address the shortage of senior firmware engineers in Taiwan, AMI has formed a dedicated training team, offering modular development interfaces for seasoned engineers and complete training and certification processes for newcomers, accelerating client team growth.Simultaneously, AMI continues to develop its OneTree Development Studio tools for building a code environment, firmware update tool, and DCM multi-server/rack management, extending open architecture from single-server to rack-level to meet centralized management needs for large-scale cloud and AI infrastructures.Additionally, AMI plans to promote the "Meridian Triple-Win Validation Platform," which pre-validates ODM hardware platforms using its own open-source code. This enables CSPs to directly select hardware and firmware combinations that match their needs and improve consistency in firmware experience. For ODMs, obtaining AMI certification expands market opportunities, while AMI broadens its platform coverage, achieving a win-win-win for CSPs, ODMs, and AMI.United with Taiwan's ODMs: From Manufacturers to DefinersObserving recent industry developments, Tao believes Taiwan's ODMs and system integrators have shifted from passive manufacturers to frontline product definers. They now directly understand customer needs and provide rapid feedback for design and supply chains.He highlights three advantages Taiwan companies bring to the OCP/SRI ecosystem: direct connections to global cloud/AI clients, high development flexibility, and the potential to evolve from ODMs to OEMs or even service providers.AMI's relationship with ODM clients has transformed into a partnership in facing end customers. By leveraging mutual insights into both market and design, collaboration improves product development efficiency and alignment. Tao concludes by stressing that open source is not about "passing the baton to the community," but a joint effort in maintenance and implementation, balancing technical openness with business value. The fusion of Taiwan's ODMs and AMI will become a best-practice model for rolling out open system architectures.As open architecture becomes mainstream, those able to provide stable infrastructure, professional integration, and ongoing support will play a pivotal role in the new ecosystem. AMI will continue to serve as a strong backbone for Taiwan's industry as it transitions toward open source, with deep firmware expertise and access to global ecosystem resources.Kenneth Tao, Director of Business Development at AMI

The year 2025 marks a pivotal moment in the accelerated adoption of artificial intelligence (AI). The rapid uptake of intelligent terminals—such as AI PCs, AI smartphones, and AI servers—has fueled the rise of innovative applications, including generative AI, autonomous driving, AI glasses, and embodied AI. Amid this evolution, storage systems have emerged from the background to take the center stage, serving as a key underpinning for enhancing AI experiences and driving systemic transformation.In the face of the high demands of bandwidth, power consumption, latency, capacity and dimension across diverse AI-driven scenarios, significant breakthroughs have been achieved in new-generation high performance storage technologies like LPDDR5X/DDR5, QLC NAND, LPCAMM, and CXL. Integrated innovations in chip design, controller algorithms, and packaging and testing processes are propelling the industry into a new phase of AI-driven transformation.In this dynamic context, the "Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum)", co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., is scheduled to be held on September 24–25, 2025, at the Renaissance Shenzhen Bay Hotel.GMIF2025 is scheduled to take place on September 24–25, 2025, at the Renaissance Shenzhen Bay HotelPhoto: Shenzhen Memory Industry AssociationUnder the theme of "AI Applications, Innovation Empowered", the summit will delve into three key topics, specifically emerging trends in storage technologies, real-world AI applications, and collaborative innovation across the storage industry chain. Representative enterprises across all segments of storage ecosystem, comprising wafer IDM manufacturers, controller and module suppliers, packaging and testing providers, and AI platform vendors, will come together to collectively explore innovation pathways and ecosystem development in the AI era. The key focal points of GMIF2025 include:Trends and Roadmaps of Storage Technologies:Centered on AI-driven storage innovations, the summit will explore industrial progresses in forefront technologies, and further map out the trajectory for storage's enhanced value in the evolving compute architecture.New Opportunities in Storage Driven by AI Applications:Focusing on core AI-based scenarios such as AI PCs, AI smartphones, AI servers, generative AI, autonomous driving, AI glasses and embodied AI, the summit will address emerging storage requirements in terms of performance, power consumption, capacity and form factor, and explore innovation at the intersection of technology and application.Collaborative Innovation Across the Industry Chain:In the context of post-globalization supply chain restructuring, the summit will concentrate on strategic collaboration across the storage industry chain to bridge supply-demand gaps and cultivate a resilient, efficient, and innovation-driven global ecosystem.GMIF2025 Agenda OverviewPhoto: Shenzhen Memory Industry AssociationIndustry Breakdown of Attendees: Based on GMIF2024 DataPhoto: Shenzhen Memory Industry AssociationGMIF2024, successfully held last year, brought together over 30 core industry enterprises for keynote presentations, featured 33 exhibiting companies showcasing more than 150 innovative products, and presented 38 annual awards. The event garnered over 680 million impressions across all channels, attracted more than 1,400 professional attendees, and received widespread acclaim from both industry and the public.During GMIF2024, global live broadcast of memory trends by brands achieved a cumulative viewership of over 76,000 and total exposure exceeding 1 million.Highlights from GMIF2024Photo: Shenzhen Memory Industry AssociationAnnual Awards & Industry RankingsTo recognize and celebrate outstanding enterprises for their remarkable contributions to innovation and development in the global memory industry, GMIF2025 will continue to honor exemplary companies across five award categories: Industry Contribution Award, Terminal Application Award, Solution Award, Technology Innovation Award, and Market Service Award. In addition, the Shenzhen Memory Industry Association (SMIA), in collaboration with the School of Integrated Circuits at Peking University and JWinsights (Shanghai) Technology Co., Ltd., will unveil the highly anticipated Memory Industry Ranking during the summit.Looking back at GMIF2024, a distinguished group of enterprises—including Micron, Western Digital, Solidigm, CXMT, YMTC, GigaDevice, Intel, Arm, Rockchip, UNISOC, Allwinner Technology, Silergy, Victory Giant Technology, Silicon Motion, BIWIN, Skyverse, QUANXING Technology, POWEV, KingSpec, Hemei Jingyi, Tongfang, Weibu Information, SIXUNITED, Heyan Technology, Attach Point Intelligent Equipment, OKN Technology, InnoGrit, Tytantest, iWISEETEC, MICROFROM, Konsemi, LKAUTO, Maxwell, RORZE, ExTripod Electronics, EPS, LANYI, and many others—were recognized with the 2024 Annual Awards for their outstanding contributions to the storage and memory industry.Feedback from Previous AttendeesPhoto: Shenzhen Memory Industry AssociationJoin us at the Fourth GMIF2025 Innovation Summit on September 24-25, 2025, in Shenzhen! Click the link below to register now and secure your seat.Registration link: https://jsj.top/f/KQLpk0

Rugged embedded computer brand - Cincoze's Red Dot Award-winning MXM GPU computer series (GM-1100) has the high performance, compact design, and expansion flexibility that make it the ideal choice for space-constrained Edge AI applications. The GM-1100 series supports the latest 14th Gen. Intel Core processors and NVIDIA MXM GPU modules, providing the ultimate computing performance and graphics processing capabilities for real-time decision-making and high-speed AI Edge computing. The GM-1100 is only 260 x 200 x 85 mm, but it maximizes expansion flexibility and can easily meet the application needs of multiple vertical industries, especially in transportation, manufacturing, and defense.Transportation: Improving Safety and FlowTransportation: Improving safety and flowAirport E-gates and X-ray scanners, powered by the GM-1100, enhance customs clearance efficiency and aid in automating security checks. The GM-1100 efficiently handles multiple tasks simultaneously, performing image processing and real-time analysis by leveraging the combined power of the CPU and GPU. It offers native rich I/O and expandable I/O to support LAN, COM, USB, and DIO interfaces, for flexible connectivity with peripherals such as cameras, passport readers, and gate controllers. Its wide temperature design (-40°C to 70°C), combined with its fanless architecture, can effectively overcome the challenges of high temperatures and dust when installed in an electrical enclosure. It effectively achieves fast and accurate identity recognition and prohibited goods detection, optimizing customs clearance efficiency and overall safety.Manufacturing: Boosting Efficiency and YieldManufacturing: Boosting efficiency and yieldAutomated optical inspection (AOI) and robotic bin-picking systems benefit from the powerful performance and rapid data transfer of the GM-1100, making it an optimal computing solution. The potent AI inference capabilities of the MXM GPU enable swift and precise identification of product defects and object location, significantly boosting inspection and overall operational efficiency. The high-speed I/O interfaces, including up to 10GbE LAN, 20Gbps USB 3.2 Type-C, and an M.2 Key M slot for expansion with high-speed NVMe SSDs, fully meet the high-speed transmission and extensive storage requirements of high-resolution image processing. To address the challenges in installation environments with high electromagnetic interference, the GM-1100 adheres to industrial-grade EMC standards. It has successfully obtained CE, UKCA, and FCC certifications, and complies with ICES-003 Class A level. It supports multiple installation methods, such as wall, side, DIN rail, and VESA, for enhanced deployment flexibility.Defense: Enhancing Intelligence and ReconnaissanceDefense: Enhancing intelligence and reconnaissanceMilitary reconnaissance and information gathering can leverage the rugged design and efficient computing of the GM-1100. Its MXM GPU module enables high-speed parallel computing for real-time image analysis and terrain recognition, facilitating battlefield map construction and mission assessment. The built-in M.2 Key B expansion slot supports a GNSS module for high-precision positioning. Its wide voltage design (9-48V) allows flexible installation in military vehicles, surface vessels, and other mobile equipment, and it is equipped with an IGN (Power Ignition Sensing) delayed power on/off function that prevents system damage and data loss from temporary shutdowns or unstable power. Having passed the MIL-STD-810H shock and vibration test and E-mark vehicle certification ensures the stable operation of the GM-1100 in harsh environments, making it a reliable computing core for military defense systems.