Ching specializes in PCB and semiconductor substrate industry research at DIGITIMES, focusing on market trends driven by AI computing and high-speed connectivity. His coverage spans PCBs, ABF substrates, CCLs, key materials, and manufacturing equipment. By analyzing technological advancements, supply-demand dynamics, capacity expansion, and competitive developments, he helps clients identify emerging opportunities and industry trends.
Ching combines technical expertise, supply chain intelligence, and financial analysis to deliver actionable market insights. Through industry research, company interviews, and supply-demand modeling, he evaluates developments in advanced packaging, high-end substrates, and next-generation materials, providing strategic insights into market opportunities and the evolving competitive landscape.

Research Focus :
PCB and ABF Substrate Industry Trends and Market Competition
Advanced CCL and Key Materials: Technology and Supply-Demand Analysis
Advanced Packaging and Semiconductor Substrate Technology Development
AI Server and High-Speed Networking PCB Supply Chain