After months of trade negotiations, Taiwan and the US have finalized a reciprocal tariff agreement that lowers rates to 15% without stacking most-favored-nation (MFN) tariffs. The deal grants semiconductor products under Section 232 preferential treatment, expands supply chain investment cooperation, and establishes a credit guarantee fund totaling US$500 billion

The US and Taiwan have formally concluded a tariff agreement that sets a 15% rate on covered goods, alongside a sweeping package of Taiwanese commitments aimed at deepening ties with the American semiconductor industry. Under the deal, Taiwan will make US$250 billion in direct investment in US semiconductor manufacturing, while its government will provide an additional US$250 billion in credit guarantees

Singapore's sovereign wealth fund, the Government Investment Corporation (GIC), has made significant investments in artificial intelligence startups Anthropic and MiniMax amidst rising concerns about an AI investment bubble. Anthropic recently closed a funding round valuing it at US$35 billion, with GIC as a key backer. At the same time, Chinese AI startup MiniMax saw a strong stock debut on the Hong Kong Stock Exchange, also reportedly supported by GIC

The long-discussed Taiwan-US tariff negotiations have finally concluded, agreeing on US$500 billion investment and reciprocal tariffs aligned with those of the EU, Japan, and South Korea without stacking. These terms match disclosures from US sources

Record profits. Soaring margins. Relentless demand. TSMC's January 15, 2026, earnings call painted a picture of semiconductor dominance so complete it seems almost untouchable. Almost

The White House has finally released details regarding chip tariffs. Despite previous concerns, tariff rates and products included are relatively limited. The tariff rate has been set at 25%; chips imported for data centers, startups, technology R&D, maintenance and replacement, consumer applications, industrial control applications, as well as any chips used to build US industries, are all exempt from the tariffs

TSMC announced plans in 2020 to establish an advanced wafer fab in the US, marking a major shift toward significant US investments. Initially seen as a political necessity, TSMC's US expansion has evolved over five years into a long-term commitment exceeding US$165 billion, supporting American manufacturing ambitions

For years, smart glasses and augmented reality (AR) headsets were among the most visible attractions at the Consumer Electronics Show (CES), peaking in 2025 when they dominated the exhibition floor. At CES 2026, their presence was noticeably reduced. This does not point to an industry slowdown. Rather, it signals the sector's exit from the "concept phase" and its entry into a market defined by price competition and practical commercialisation

China's Ministry of Industry and Information Technology, together with eight other government departments, has released the plan for "AI + Manufacturing." While framed as an industrial upgrade policy, it functions in practice as a strategically significant AI roadmap

China has intensified pressure on Japan's supply chains. Following curbs on dual-use items and rare earth exports, the Ministry of Commerce has launched an anti-dumping probe into Japanese-origin dichlorosilane (DCS)

China's Ministry of Commerce said on January 7, 2026, that it has launched an anti-dumping investigation into Japanese-origin dichlorosilane (DCS). While framed as a routine trade-remedy case under existing rules, the decision reflects a more specific reality in the semiconductor materials supply chain: China now has domestic fallback capacity in this critical process material, allowing policymakers to act selectively at a sensitive juncture

Recent supply-chain signals suggest that OpenAI has shifted hardware orders from Luxshare to Foxconn, a move widely interpreted as preparation for highly interactive, portable AI devices. While specifications remain undisclosed, industry sources believe the products will emphasize real-time interaction tightly coupled with cloud-based AI, pointing to a new class of always-connected endpoints rather than conventional consumer electronics

Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and 2nm capacity is largely locked in. Advanced packaging now contributes a growing share of sales. The company is on track to see annual revenue exceed US$250 billion around 2029 or 2030. That widening gap has pushed Japanese companies to focus on panel-level packaging and nanoimprint technologies. Both emerged at SEMICON Japan 2025 as key levers to bypass manufacturing bottlenecks and secure a foothold in the fast-expanding AI accelerator supply chain

Artificial intelligence continues to be the central force behind the upcoming productivity revolution. Yet in the US, foundational energy constraints threaten to stall progress. The primary obstacle is not a shortage of semiconductor chips or inadequate computing capacity. It is a more fundamental resource: electricity. Increasing demand from AI data centers (AIDCs) is straining the nation's electric grid. It is testing the limits of social tolerance

The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade Statistics (WSTS) forecast, released in December 2024, expects growth to be driven predominantly by logic chips, including GPUs and AI accelerators. Memory markets are poised for the steepest increase