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Winbond introduces a new unique and innovative product QspiNAND Flash for use with the Qualcomm 9205 LTE Modem
Tuesday 16 June 2020
Status of global wafer foundry industry, 2023
The global foundry industry's combined revenues in 2023 are expected to shrink more than 10% on year after a growth of nearly...
Global mobile device shipment forecasts, 2023 and beyond: Smartphones, notebooks and tablets
DIGITIMES Research expects smartphone shipments to grow 2-9% a year throughout the period from 2023-2027 with the CAGR for the...
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Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance...