GlobalFoundries revives 7nm-class ambitions with an EUV-free FD-SOI bet on physical AI
1min ago in Semiconductors
Applied Materials lifts 2030 margin goals, but a missing industry forecast sends a disappointing signal
2min ago in Semiconductors
Analysis: China's EV rebate cut pushes exporters from volume to value
4min ago in Electric Vehicles
Foxconn unveils Vera Rubin AI racks, liquid-cooling systems at OCP Summit
5min ago in ICT
NTT Data, Anthropic negotiate Japan data center with up to 500MW
5min ago in East Asia
Apple COO visits Foxconn as iPhone Duo production ramps up
5min ago in Communications
TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
9min ago in Semiconductors
Former Intel CEO Pat Gelsinger sees hardware renaissance in memory, optical interconnects
9min ago in Semiconductors
Shield AI delivers first V-BAT drone to Taiwan Coast Guard
9min ago in Aerospace
Starlink moves from satellite overlay to mobile challenger as SpaceX builds hybrid network
10min ago in Aerospace
AI memory boom pushes smartphone market into premium-first reset
11min ago in Communications
PMIC vendors diverge as PC exposure drives revenue gap
15min ago in Semiconductors
Huawei accelerates ASEAN data center hardware supply as Kunpeng chip exports surge
15min ago in ICT
Smartphone costs surge as brands take divergent action
18min ago in Communications
Taiwan FPCB maker CMI targets flat 2026 revenue despite memory, CPU shortages hitting notebook demand
18min ago in Semiconductors
Linde LienHwa links HaaS ecosystem to drive industrial decarbonization
18min ago in Sustainability
Y.S. Tech reports liquid-cooling orders secured through early 2028
19min ago in Electric Vehicles
India's Tessolve raises US$75 million from Vector Line Capital to fund chip-services acquisitions
19min ago in Semiconductors
Amazon's Decart talks point to a broader push from custom silicon to world models
32min ago in ICT
China's wafer-scale graphene breakthrough brings quantum rectifiers closer to semiconductor integration
33min ago in Semiconductors
Shanghai HiSilicon expands DDI push across all display sizes
Oct 13, 18:14 in Tomorrow's Headlines
Applied Materials CEO outlines a trio of innovation priorities for AI chip race
Oct 13, 18:13 in Tomorrow's Headlines
China’s domestic AI chips target 3D packaging, optical interconnects and software ecosystems
Oct 13, 18:13 in Tomorrow's Headlines
AI accelerator growth shifts toward value, not volume
Oct 13, 18:13 in Tomorrow's Headlines