TCB packaging crucial in AI and HPC applications, says ASMPT
4min ago in Semiconductors
ASML confirms shipping third High NA EUV, remains optimistic about long-term growth despite weak 2025 outlook
10min ago in Semiconductors
Samsung and Tamil Nadu confirm end of workers' strike in India
10min ago in South Asia
ASML's order plunge suggests Intel and Samsung pullback, potentially benefiting TSMC
18min ago in Semiconductors
TSMC raises CoWoS output goal again, say sources
19min ago in Semiconductors
Upcoming Largan earnings: Market focus on new iPhone sales performance
12h 10min ago in Tomorrow's Headlines
Luxshare steps up capacity expansion in Vietnam
12h 26min ago in Tomorrow's Headlines
Chipmakers reportedly vying for orders for upcoming Samsung FE smartphone series
12h 30min ago in Tomorrow's Headlines
AUO denies FOPLP segment entry rumors
Oct 15, 19:50 in Tomorrow's Headlines
FPC specialist Complex Micro to boost production in Thailand
Oct 15, 19:45 in Tomorrow's Headlines
Chinese CIS firms gain flagship smartphone market share
Oct 15, 19:38 in Tomorrow's Headlines
Premature consumption could freeze China's auto market in 2025
Oct 15, 19:34 in Tomorrow's Headlines
New car sales in China increase
Oct 15, 19:23 in Tomorrow's Headlines
Taiwan server assemblers accelerate production relocation overseas
Oct 15, 19:14 in Tomorrow's Headlines
Digital twins and AI advance self-driving technologies, says ASMPT
Oct 15, 19:07 in Tomorrow's Headlines