IC packagers take up over 60% of China’s IC production value

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Comments from readers

Janet Wang, Hsinchu; Juliet Tzou, DIGITIMES Asia

Friday 9 November 2001

Add your comments

Can we post your comment and/or question anonymously on this page (for anyone to read)?
Yes No

Realtime news

'Hardware is sexy again': Plug and Play CEO says AI boom has finally fulfilled his 2006 semiconductor dream
The building where Saeed Amidi runs his global venture empire was once one of the most important semiconductor...

Huawei's Tau Law
Huawei’s Tau Law is Huawei’s post-Moore framework that says chip performance can be improved by reducing time delays through coordinated...

The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030

Mastering the 140%+ CAGR of CPO Semiconductor Revenue Explosion

What Nvidia and Broadcom's CPO bets reveal about the future of AI infrastructure

The CPO market is projected to grow sharply by a 142% CAGR from 2026 to 2030 (excl. ELS) and as AI clusters scale and 3.2T data...

Accelerating enterprise AI: Hardware advancements and compute architecture transformation

According to DIGITIMES, six major AI applications - chatbots, software development, image generation, video generation, enterprise...

10 days cloud