Samsung moves up HBM packaging plant opening to June 2028

, DIGITIMES, Taipei

Nov 12, 2026, 13:57 0

Samsung Electronics' Onyang semiconductor campus in Asan, South Korea. Credit: Samsung

Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging plant in South Korea by one year to June 2028 to meet rising demand for AI server memory.

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