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Home Tech Semiconductors

Kinsus explores AlN ceramics beyond glass for AI advanced packaging

Jessie Lin, DIGITIMES Intelligence

Oct 29, 2026, 07:50 0

Credit: DIGITIMES

Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass amid ongoing brittleness and reliability challenges, according to R&D vice...

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