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Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?

Staff reporter, commentary
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Credit: Huawei

On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding and hybrid bonding technologies...

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