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SK Hynix faces US patent fight over HBM, 3D NAND

, DIGITIMES, Taipei
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Credit: SK Hynix

SK Hynix is facing an expanding US patent dispute with MonolithIC 3D. A second US International Trade Commission (USITC) investigation covers high-bandwidth memory (HBM) and 3D NAND products, alongside parallel litigation in federal court.

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