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Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

Levi Li

Levi Li

, DIGITIMES, Taipei

Jul 13, 2026, 10:48 0

Credit: AFP

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.

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