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Home Tech Semiconductors

TSMC expands CoWoS and SoIC capacity on AI boom

Monica Chen

Monica Chen

, Hsinchu

May 14, 2026, 16:06 0

TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide...

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EDOM Accelerates Edge AI Deployment with NVIDIA Technologies

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