TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV

Jingyue Hsiao

, DIGITIMES Asia, Taipei

Apr 23, 2026, 10:19 0

Credit: AFP

TSMC is accelerating its advanced packaging expansion in the US while maintaining a conservative stance on next-generation lithography, as the company balances cost pressures, AI-driven demand, and long-term manufacturing diversification. Analysts say...

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