Odisha to break ground on India's first advanced 3D chip packaging unit

Jingyue Hsiao

, DIGITIMES Asia, Taipei

Apr 20, 2026, 12:28 0

Credit: AFP

Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous integration capacity in South Asia, attracting investment for aerospace,...

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