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Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam

Amy Fan, Taipei

Apr 14, 2026, 14:52 0

Credit: Semco

As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics (Semco) is reportedly establishing a new production line for multilayer...

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