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Amkor eyes triple revenue growth in 2.5D and HDFO packaging for 2026

Flora Wang, Taipei Mar 6, 2026, 15:42 0

Credit: DIGITIMES

Semiconductor OSAT leader Amkor has announced plans to boost its capital expenditure budget for 2026 to US$2.5-3 billion, prioritizing expansion of advanced packaging capacities such as 2.5D and high-density fan-out (HDFO) in South Korea and Taiwan...

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