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Fiberglass shortage persists in 2026, Unimicron increases substrate price

Flora Wang, Taipei; Emily Kuo, DIGITIMES Asia Thursday 26 February 2026 0

Credit: DIGITIMES

As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly leading a market recovery, gradually breaking free from the post-pandemic...

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