Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US and its allies use stringent export controls to reshape the advanced node industry order, China's semiconductor industry is aggressively pursuing self-sufficiency across equipment, materials, and processes to mitigate reliance on foreign suppliers.
Recent strategic manoeuvres by Naura Technology (Naura) and ACM Research (ACM) distinctly reflect this geopolitical pivot in the equipment market.
Naura's strategic M&A targets optics for pan-semiconductor growth
In early December, Naura completed the acquisition of approximately 90% equity in Chengdu Guotai Vacuum Equipment Co., formally integrating the optics specialist into its portfolio.
Established in 2013, Chengdu Guotai specializes in optical vacuum deposition equipment, with applications spanning optical instruments, communications, smartphone lenses, sensors, and emerging sectors like AR/VR and automotive electronics.
The firm holds foundational proprietary technology in electron-beam evaporation and magnetron sputtering tools, along with key modules like RF ion sources and optical thickness monitoring systems.
As the US-China conflict continues, export controls on advanced process equipment and critical components have created significant supply uncertainty for Chinese chipmakers in these key equipment segments.
Naura's acquisition enhances its optical vacuum equipment capabilities, helping complete its semiconductor and pan-semiconductor equipment roadmap. This move highlights a Chinese equipment strategy favoring capital integration to rapidly gain mature technology and established customer bases.
Though not a front-end process tool, optical coating equipment is a critical foundational asset for emerging markets like automotive sensing, advanced displays, and optical modules. Its supply stability directly impacts downstream product performance and mass production capability.
ACM Research positions for HBM and advanced packaging uptake
Separately, ACM Research is consistently penetrating the High Bandwidth Memory (HBM) and advanced packaging equipment market. It has introduced tools compatible with HBM processes, including the Ultra ECP 3D electroplating system for through-silicon via (TSV) copper filling. These wet cleaning, plating, and assembly-related systems extend to 2.5D packaging for AI chips. Crucially, the cleaning equipment is optimized for the high aspect ratio and 3D structures critical for HBM yield and reliability.
Critically, as the US tightens controls on advanced fabrication tools, wet cleaning and electroplating equipment have become steps with greater operational latitude. While these processes avoid highly sensitive technologies like lithography, they are indispensable in advanced nodes, offering domestic suppliers a vital entry point into the international supply chain.
Reports indicate ACM's tools are entering verification and testing with several international customers. This suggests major foundries, motivated by cost optimization and supply chain resilience, are actively evaluating diversified equipment sourcing options.
From a macro perspective, the US-China conflict has not fundamentally changed the semiconductor industry's nature of specialized division of labor and global collaboration. It has, however, undeniably accelerated the push for supply chain diversification.
Naura's M&A-driven optical equipment strategy, combined with ACM Research's persistent HBM and advanced packaging push, shows that Chinese equipment vendors are effectively seeking viable, mass-producible market positioning within the geopolitical constraints of US-China competition.
Article translated by Levi Li and edited by Jack Wu
