The IMPACT Conference, Asia's largest international event on advanced packaging and circuit boards, will celebrate its 20th anniversary this year at Nangang with its biggest program to date. Running from October 21–24, and held concurrently with the TPCA Show (October 22–24), IMPACT 2025 will spotlight the theme: "Energy-Efficient AI: From Cloud to Edge." The conference will examine how AI applications are expanding from massive data centers to edge devices, underscoring the critical role of semiconductor packaging, PCBs, IC substrates, and advanced technologies in enabling high-performance, low-power solutions. Taiwan's leadership as a global hub for semiconductor packaging and circuit boards will once again take center stage.
Opening Keynotes – TSMC × AWS × Intel
On October 21, the opening ceremony at the Taipei HNLAI Hotel will feature three industry leaders:
-Dr. Frank Lee, Vice President, TSMC – on advanced process nodes, 3D integration, and CoWoS/InFO packaging to achieve high-efficiency computing and sustainable AI infrastructure.
-Dr. Babak Sabi, Vice President, AWS – on packaging and system challenges for rapidly expanding AI data centers and strategies to address them.
-Jatin Upadhyay, Vice President, Intel – on next-generation data center architecture, including memory, interconnects, power and thermal management, and supporting software ecosystems.
Together, they will chart the future blueprint for AI efficiency, packaging technology, and system design.
Global Spotlight – Japan & Korea Experts
Following days will feature:
-Dr. Takao Iwaki, Director, Mirise Technologies – on chiplet and SoC solutions for advanced driver-assistance systems (ADAS).
-Dr. Sung Jin Kim, CTO, Absolics – on next-generation glass substrates and their opportunities and challenges.
40+ Technical Sessions across 3 Days
Over three days, 40+ technical forums will bring together global leaders such as AMD, Applied Materials, ASE, Intel, Lam Research, MKS' Atotech, Qnity, DuPont Electronics, and SPIL. Highlights includes, Japan & Korea sessions (JIEP, ICEP, ISMP) delivering first-hand insights. A debut Open Seminar co-hosted with TPCA Show featuring Applied Materials, Reconac, Sony, Yole, and industry expert Rocky Wu. The SMTA Forum, offering global perspectives on advanced packaging and PCB technologies.
20th Anniversary – Industry × Academia for the AI Era
For two decades, IMPACT has been the premier international platform for industry-academia exchange in packaging and PCB. To mark its 20th year, IMPACT 2025 will introduce the "Student Program" for Students, offering: Learning through the Master Lecture featuring professors from National Yang Ming Chiao Tung University and the National University of Singapore, Networking through dedicated academia-industry matchmaking and Career opportunities with exclusive gifts and activities designed to engage young talent.
Additionally, the 20 Legacy Series will bring together global industry leaders and the next generation of professionals to embrace the future of AI and semiconductors. Click here to register now.
Plenary Speaker at IMPACT 2025 highlights advanced packaging and AI trends. IMPACT
IMPACT 2025 marks its 20th anniversary with the Legacy Event. IMPACT
Article edited by Joseph Tsai