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China develops next-gen EUV photoresist in bid to break US tech blockade

Staff reporter, Taipei; Levi Li, DIGITIMES Asia 0

Credit: Tsinghua University

Amid tightening US and Dutch export controls on advanced semiconductor equipment, especially ASML's extreme ultraviolet (EUV) lithography systems, China's Tsinghua University has announced a breakthrough in a critical material: EUV photoresist.

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