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Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?

Jessica Tsai, Taipei; Levi Li, DIGITIMES Asia 0

Credit: Samsung

Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging. Testing is underway, with commercialization dependent on market demand...

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