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HBM equipment race intensifies as newcomers battle for market entry

Cheng-Yu Jiang, Seoul; Emily Kuo, DIGITIMES Asia Tuesday 22 July 2025 0

Credit: Hanmi Semiconductor

Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current market leader, Hanmi Semiconductor, several Korean firms have also...

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