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Home Tech Semiconductors

TSMC said to adopt larger glass substrates for FOPLP

Rebecca Kuo

Rebecca Kuo

, Tainan

Jul 24, 2024, 09:03 0

Credit: DIGITIMES

Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing...

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STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility

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