Resonac forms alliance developing advanced packaging in US

Chiang, Jen-Chieh, Taipei; Jingyue Hsiao, DIGITIMES Asia 0

Credit: Resonac

A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies to verify the latest concepts and innovations in the field.

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