SK Hynix announces deepening cooperation with TSMC to develop sixth-generation HBM

Amy Fan, Taipei; Jack Wu, DIGITIMES Asia 0

Credit: AFP

On April 19, SK Hynix announced that it had recently signed a memorandum of understanding (MOU) with TSMC. The two companies will collaborate closely on producing next-generation high bandwidth memory (HBM) products and enhancing advanced packaging...

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