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Advanced packaging capacity to surge 30–40% in 2024, says TrendForce

Jessie Shen, DIGITIMES Asia, Taipei Tuesday 22 August 2023 0

Credit: DIGITIMES

With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40% in 2024, according to TrendForce.

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