Samsung said to mass produce over-300-layer 3D NAND chips in 2024 with double-stack process

Amy Fan; Willis Ke, DIGITIMES Asia 0

Credit: Samsung

To solidify its leading position in the NAND flash market, Samsung Electronics reportedly plans to again utilize a double-stack technology for manufacturing 3D NAND over 300 layers, aiming to surpass competitors with a production cost advantage.

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