Amkor ramping up advanced packaging production capacity

Julian Ho, Taipei; Rodney Chan, DIGITIMES Asia 0

Credit: Nvidia

Amkor Technology is ramping up its capacity for advanced packaging production, with monthly output for 2.5D packaging expected to reach 5,000 wafers in the first half of 2024, up from 3,000 units in early 2023, according to industry sources.

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