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SoIC technology enhances TSMC cooperation with OSAT players

Julian Ho, Taipei; Misha Lu, DIGITIMES Asia Monday 12 June 2023 0

Credit: DIGITIMES

TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip (SoIC) technologies focused by AP6 can be flexibly...

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