Global wafer foundry industry analysis and forecast, 2022

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Home Tech Semiconductors

Apple UltraFusion relies on TSMC 3DFabric packaging technology

Julian Ho, Taipei; Rodney Chan, DIGITIMES Asia Wednesday 7 June 2023 0

Credit: Apple

Apple's innovative UltraFusion packaging architecture relies on TSMC's 3DFabric packaging platform, according to industry sources.

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