Ingrasys, a global leading cloud IT and infrastructure provider, today announced its participation at Supercomputing 2022, which takes place at the Kay Bailey Hutchison Convention Center Dallas from November 14-17. This year, Ingrasys continued to take its HPC solutions to a new level with its revolutionary modular innovations that are ready to fuel the next wave of applications and services.
As a company taking the lead in embracing modular concept, Ingrasys unveiled its latest modular solutions to redefine the next-gen data center. At SC22, Ingrasys introduced a new addition to its NVMe-oF storage family, ES2100, which is composed of dual redundant switch modules to guarantee high availability. The new product delivers higher throughput and supports 400GbE Ethernet connectivity for extreme networking performance. What's more, with modularity and innovative chassis design, the product family allows for easy system upgrade just by changing its switch modules.
Besides storage systems, two Modular Servers that feature different platforms and cooling solutions were also on display. Powered by the latest 4th Gen AMD EPYC processors, the SV1120 Series delivers breakthrough performance with a rich feature set. The series supports emerging DDR5 memory, E3.S CXL memory expansion modules, PCIe 5.0 technology, and wide I/O and drive options. Its DC-SCM (Datacenter Secure Control Module) enables server management and security onto a common form factor and interface that can be used across platforms. With EIA 19" & ORv3 21" racks compatible, and both air-cooled and rack-integrated liquid cooling solutions, the SV1120 Series maximizes the benefits of modular design to accommodate different user preferences and empowers a wide spectrum of workloads.
"4th Gen AMD EPYC processors continue to raise the bar for workload performance in the modern data center while simultaneously delivering exceptional energy efficiency. 4th Gen AMD EPYC processors will transform our customers' data center operations by accelerating time to value, driving lower total cost of ownership, and helping enterprises to address their sustainability goals," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD.
Other exciting exhibitions at booth #538 include a see-through demo tank showcasing advanced immersion cooling technology, a fully-integrated ORv3 air-assisted rack featuring Ingrasys state-of-art technologies, as well as a 3D interactive virtual booth experience highlighting total cloud-to-edge solutions. As always, Ingrasys is committed to providing advanced HPC solutions that continue to accelerate innovations and performance for the future.
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