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Metaverse concepts boost demand for IC packaging equipment, says K&S executive

Julian Ho, Taipei; Adam Hwang, DIGITIMES 0

K&S executive vice president Chong Chan-pin. Credit: K&S

Along with emerging metaverse concepts, there is growing demand for equipment for package IC and HPC (high-performance computing) chips, as well as bonding mini/microLED chips, according to executive vice president Chong Chan-pin for Singapore-based...

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