中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Nvidia
TSMC
AI Search
NTN Convergence
Robotics Report
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
Home
Research
Research insights
South Korea may adjust tech policies; Sony and Honda to deliver first EV by 2025; India's data center market expanding
Tom Lo, DIGITIMES Research, Taipei
Wednesday 16 March 2022
0
The Research analysis you are trying to open requires subscription to any of the DIGITIMES Research services. Please
sign in
if you wish to continue.
Introduction
Related story
Honda, Mazda plan to relocate supply chain makers from China
Tags
Asia enterprises
Digitimes Research
Honda
India
Sony
South Korea
Share this article
Other links
Print
BIZ FOCUS
Dec 24, 08:00
InnoPad Taipei to debut in 2026 as Taipei's flagship hub for global startups
Wednesday 24 December 2025
How Technology Is Changing How We Game Online
Wednesday 24 December 2025
GameSir to Showcase Next-Generation Gaming Hardware at CES 2026
Wednesday 24 December 2025
From Executive Leadership to Doctoral Impact : HEC Liege Executive DBA
MOST-READ
7 DAYS NEWS
TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
TSMC expands CoWoS capacity with Nvidia booking over half for 2026-27
Google and Microsoft prioritize speed over cost as CSPs scramble for memory
Google TPU demand remains strong, but CoWoS and memory cap 2026 production
'Father of Immersion Lithography' warns: Intel's TSMC talent grab invites process tech scrutiny
Asus halts 2026 smartphone plans, eyes entry into drone and AI glass markets
Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
Chang Wah accelerates Asia expansion as chip packaging booms
Analysis: Chip boom squeezes device makers as surging component costs threaten margins
Commentary: When the grid can't keep up with the algorithm
Full list
Join our mailing list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first