TSMC, Unimicron to offer production solutions for Apple M1 Ultra

Jay Liu, Taipei; Willis Ke, DIGITIMES Asia 0

Credit: Apple

Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging technology, with the required ABF substrates to be solely supplied...

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.